Inventor · disambiguated record
Yasuo Kasagi
Also filed as: KASAGI YASUO
11 granted patents·1 pending application·467 citations·filing 1994–2024
93Inventor score
Top patents by PatentIndex Score
12 records- 0198US10020363B2Bulb-shaped memory stack structures for direct source contact in three-dimensional memory deviceSANDISK TECHNOLOGIES LLC·Filed 2017·Granted Jul 10, 2018·51 cites·17 claims
- 0298US10008570B2Bulb-shaped memory stack structures for direct source contact in three-dimensional memory deviceSANDISK TECHNOLOGIES LLC·Filed 2017·Granted Jun 26, 2018·62 cites·16 claims
- 0398US9985098B2Bulb-shaped memory stack structures for direct source contact in three-dimensional memory deviceSANDISK TECHNOLOGIES LLC·Filed 2017·Granted May 29, 2018·85 cites·11 claims
- 0497US10381443B2Bulb-shaped memory stack structures for direct source contact in three-dimensional memory deviceSANDISK TECHNOLOGIES LLC·Filed 2018·Granted Aug 13, 2019·28 cites·10 claims
- 0597US9876031B1Three-dimensional memory device having passive devices at a buried source line level and method of making thereofSANDISK TECHNOLOGIES LLC·Filed 2017·Granted Jan 23, 2018·113 cites·14 claims
- 0696US9991282B1Three-dimensional memory device having passive devices at a buried source line level and method of making thereofSANDISK TECHNOLOGIES LLC·Filed 2017·Granted Jun 5, 2018·26 cites·8 claims
- 0793US11778818B2Three-dimensional memory device with punch-through-resistant word lines and methods for forming the sameSANDISK TECHNOLOGIES LLC·Filed 2020·Granted Oct 3, 2023·3 cites·7 claims
- 0892US10381373B2Three-dimensional memory device having a buried source line extending to scribe line and method of making thereofSANDISK TECHNOLOGIES LLC·Filed 2017·Granted Aug 13, 2019·36 cites·15 claims
- 0965US5773890ASemiconductor device that prevents peeling of a titanium nitride filmNIPPON STEEL CORP·Filed 1996·Granted Jun 30, 1998·33 cites·31 claims
- 1061US2025300069A1Semiconductor device containing self-aligned via structures and etch-stop dielectric layer and methods for forming the sameSANDISK TECHNOLOGIES LLC·Filed 2024·Application pending·0 cites
- 1155US5502006AMethod for forming electrical contacts in a semiconductor deviceNIPPON STEEL CORP·Filed 1994·Granted Mar 26, 1996·24 cites·5 claims
- 1236US5672907ASemiconductor device having character in BPSG filmNIPPON STEEL CORP·Filed 1996·Granted Sep 30, 1997·6 cites·24 claims
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →