Inventor · disambiguated record
Yu-Jen Tseng
Also filed as: TSENG YU-JEN
17 granted patents·2 pending applications·55 citations·filing 2007–2024
92Inventor score
Top patents by PatentIndex Score
19 records- 0197US9105530B2Conductive contacts having varying widths and method of manufacturing sameTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Aug 11, 2015·22 cites·20 claims
- 0293US9646923B2Semiconductor devices, methods of manufacture thereof, and packaged semiconductor devicesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2012·Granted May 9, 2017·12 cites·20 claims
- 0391US9496233B2Interconnection structure and method of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2013·Granted Nov 15, 2016·7 cites·20 claims
- 0490US9953939B2Conductive contacts having varying widths and method of manufacturing sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Apr 24, 2018·4 cites·20 claims
- 0578US9111817B2Bump structure and method of forming sameTAIWAN SEMICONDUCTOR MFG·Filed 2012·Granted Aug 18, 2015·2 cites·20 claims
- 0677US11961810B2Solderless interconnection structure and method of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Apr 16, 2024·0 cites·20 claims
- 0768US9536850B2Package having substrate with embedded metal trace overlapped by landing padTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2013·Granted Jan 3, 2017·2 cites·19 claims
- 0867US11043462B2Solderless interconnection structure and method of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Jun 22, 2021·0 cites·20 claims
- 0967US9917035B2Bump-on-trace interconnection structure for flip-chip packagesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2012·Granted Mar 13, 2018·2 cites·18 claims
- 1067US8853002B2Methods for metal bump die assemblyTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Oct 7, 2014·2 cites·20 claims
- 1166US9673125B2Interconnection structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2012·Granted Jun 6, 2017·2 cites·5 claims
- 1261US10319691B2Solderless interconnection structure and method of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Jun 11, 2019·0 cites·20 claims
- 1359US9966346B2Bump structure and method of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted May 8, 2018·0 cites·20 claims
- 1458US10008459B2Structures having a tapering curved profile and methods of making sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2013·Granted Jun 26, 2018·0 cites·20 claims
- 1558US9508668B2Conductive contacts having varying widths and method of manufacturing sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Nov 29, 2016·0 cites·20 claims
- 1655US2024293630A1Multifunctional wearing deviceTSENG YU JEN·Filed 2024·Application pending·0 cites
- 1753US10153243B2Semiconductor devices, methods of manufacture thereof, and packaged semiconductor devicesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Dec 11, 2018·0 cites·20 claims
- 1837US8664041B2Method for designing a package and substrate layoutTSENG YU-JEN·Filed 2012·Granted Mar 4, 2014·0 cites·20 claims
- 1936US2009168177A1Active reflective warning apparatusTSENG YU-JEN·Filed 2007·Application pending·0 cites
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