Inventor · disambiguated record
Daisuke Motomura
Also filed as: MOTOMURA DAISUKE
4 granted patents·40 citations·filing 2006–2019
71Inventor score
Top patents by PatentIndex Score
4 records- 0189US7872126B2Tetrahydroquinoline derivatives and a process for preparing the sameMITSUBISHI TANABE PHARMA CORP·Filed 2006·Granted Jan 18, 2011·32 cites·11 claims
- 0279US8158640B2Tetrahydroquinoline derivatives and a process for preparing the sameKUBOTA HITOSHI·Filed 2010·Granted Apr 17, 2012·8 cites·11 claims
- 0360US9228116B2Thermosetting resin composition, thermosetting adhesive sheet, and method of producing thermosetting adhesive sheetDEXERIALS CORP·Filed 2013·Granted Jan 5, 2016·0 cites·8 claims
- 0448US11084941B2Underfill material, underfill film, and method for manufacturing semiconductor device using sameDEXERIALS CORP·Filed 2019·Granted Aug 10, 2021·0 cites·18 claims
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