Inventor · disambiguated record
Kaori Tai
Also filed as: TAI KAORI
10 granted patents·7 pending applications·97 citations·filing 1999–2010
88Inventor score
Top patents by PatentIndex Score
17 records- 0194US7902610B2Semiconductor device and method for manufacturing sameSONY CORP·Filed 2010·Granted Mar 8, 2011·20 cites·8 claims
- 0286US7714393B2Semiconductor device and method for manufacturing sameSONY CORP·Filed 2007·Granted May 11, 2010·13 cites·13 claims
- 0374US6586321B2Method for forming metal silicide layerOKI ELECTRIC IND CO LTD·Filed 2000·Granted Jul 1, 2003·22 cites·27 claims
- 0472US7105458B1Method of etching semiconductor devices using a hydrogen peroxide-water mixtureOKI ELECTRIC IND CO LTD·Filed 2000·Granted Sep 12, 2006·16 cites·8 claims
- 0569US6686277B1Method of manufacturing semiconductor deviceOKI ELECTRIC IND CO LTD·Filed 2000·Granted Feb 3, 2004·16 cites·12 claims
- 0653US7088610B2Magnetic memory apparatus and method of manufacturing magnetic memory apparatusSONY CORP·Filed 2004·Granted Aug 8, 2006·8 cites·4 claims
- 0750US2007051638A1Electropolishing liquid, electropolishing method, and method for fabricating semiconductor deviceSONY CORP·Filed 2006·Application pending·0 cites
- 0850US2010052079A1Semiconductor devices and fabrication process thereofSONY CORP·Filed 2009·Application pending·0 cites
- 0946US2008105920A1Semiconductor devices and fabrication process thereofHIRANO TOMOYUKI·Filed 2007·Application pending·0 cites
- 1044US7391089B2Semiconductor device and method of manufacturing the sameSONY CORP·Filed 2006·Granted Jun 24, 2008·0 cites·13 claims
- 1143US7033943B2Etching solution, etching method and method for manufacturing semiconductor deviceSONY CORP·Filed 2004·Granted Apr 25, 2006·0 cites·4 claims
- 1241US2004159557A1Electrolytic polishing liquid, electrolytic polishing method and method for fabricating semiconductor deviceFiled 2003·Application pending·0 cites
- 1339US7141501B2Polishing method, polishing apparatus, and method of manufacturing semiconductor deviceSONY CORP·Filed 2003·Granted Nov 28, 2006·0 cites·2 claims
- 1438US2004259365A1Polishing method polishing system and method for fabricating semiconductor deviceFiled 2003·Application pending·0 cites
- 1537US2005178672A1Polishing method, polishing device, and method of manufacturing semiconductor equipmentFiled 2003·Application pending·0 cites
- 1632US2005224368A1Polishing system and polishing methodSATO SHUZO·Filed 2003·Application pending·0 cites
- 1730US6291346B1Titanium silicide layer formation methodOKI ELECTRIC IND CO LTD·Filed 1999·Granted Sep 18, 2001·2 cites·3 claims
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