Inventor · disambiguated record
Shu-Ting Tsai
Also filed as: TSAI SHU-TING
58 granted patents·8 pending applications·187 citations·filing 2010–2025
98Inventor score
Top patents by PatentIndex Score
66 records- 0199US11596800B2Interconnect structure and method of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Mar 7, 2023·6 cites·20 claims
- 0295US11011567B2Structure and method for 3D image sensorTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted May 18, 2021·3 cites·20 claims
- 0395US9553020B2Interconnect structure for connecting dies and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Jan 24, 2017·12 cites·20 claims
- 0494US9035445B2Seal ring structure with a metal padTAIWAN SEMICONDUCTOR MFG·Filed 2012·Granted May 19, 2015·14 cites·20 claims
- 0593US8461021B2Multiple seal ring structureTAIWAN SEMICONDUCTOR MFG·Filed 2012·Granted Jun 11, 2013·17 cites·14 claims
- 0692US9917121B2BSI image sensor and method of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Mar 13, 2018·6 cites·20 claims
- 0792US9412719B23DIC interconnect apparatus and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2013·Granted Aug 9, 2016·10 cites·20 claims
- 0891US10304818B2Method of manufacturing semiconductor devices having conductive plugs with varying widthsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted May 28, 2019·5 cites·18 claims
- 0991US10056353B23DIC interconnect apparatus and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2013·Granted Aug 21, 2018·9 cites·20 claims
- 1091US9287312B2Imaging sensor structure and methodTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Mar 15, 2016·7 cites·20 claims
- 1191US2025364494A13DIC Interconnect Apparatus and MethodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 1290US11798916B23DIC interconnect apparatus and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Oct 24, 2023·5 cites·7 claims
- 1390US9543257B23DIC interconnect devices and methods of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted Jan 10, 2017·11 cites·21 claims
- 1490US9455158B23DIC interconnect devices and methods of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted Sep 27, 2016·10 cites·20 claims
- 1590US9041206B2Interconnect structure and methodTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted May 26, 2015·11 cites·20 claims
- 1689US9764153B2Interconnect structure and method of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2013·Granted Sep 19, 2017·7 cites·17 claims
- 1788US9059061B2Structure and method for 3D image sensorTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Jun 16, 2015·3 cites·20 claims
- 1887US10157959B2Interconnect structure for stacked device and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Dec 18, 2018·3 cites·20 claims
- 1987US8283754B2Seal ring structure with metal padLIN JENG-SHYAN·Filed 2010·Granted Oct 9, 2012·7 cites·15 claims
- 2086US11315972B2BSI image sensor and method of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Apr 26, 2022·1 cites·20 claims
- 2186US8338917B2Multiple seal ring structureYAUNG DUN-NIAN·Filed 2010·Granted Dec 25, 2012·10 cites·14 claims
- 2285US9941249B2Multi-wafer stacking by Ox-Ox bondingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Apr 10, 2018·4 cites·20 claims
- 2385US9865645B2Interconnect structure for stacked device and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Jan 9, 2018·3 cites·20 claims
- 2484US10535706B2Interconnect structure for stacked device and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Jan 14, 2020·2 cites·20 claims
- 2584US9536777B2Interconnect apparatus and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2013·Granted Jan 3, 2017·5 cites·15 claims
- 2682US2025366228A1Semiconductor device and methods of manufacturingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 2781US12476224B23DIC interconnect apparatus and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Nov 18, 2025·0 cites·20 claims
- 2881US9525003B2Structure and method for 3D image sensorTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Dec 20, 2016·2 cites·20 claims
- 2981US9293392B23DIC interconnect apparatus and methodTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Mar 22, 2016·4 cites·20 claims
- 3077US10096515B2Interconnect structure for stacked deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2013·Granted Oct 9, 2018·3 cites·20 claims
- 3177US9536920B2Stacked image sensor having a barrier layerTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted Jan 3, 2017·3 cites·20 claims
- 3276US12381195B2Semiconductor devices and methods of manufacture thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Aug 5, 2025·0 cites·20 claims
- 3376US11916091B2BSI image sensor and method of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Feb 27, 2024·0 cites·22 claims
- 3476US10269843B2BSI image sensor and method of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Apr 23, 2019·1 cites·20 claims
- 3574US10847560B2BSI image sensor and method of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Nov 24, 2020·0 cites·17 claims
- 3674US10157891B23DIC interconnect apparatus and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Dec 18, 2018·1 cites·20 claims
- 3772US9076715B2Interconnect structure for connecting dies and methods of forming the sameTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Jul 7, 2015·2 cites·20 claims
- 3871US11915977B2Interconnect structure for stacked deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Feb 27, 2024·0 cites·20 claims
- 3970US11018177B2Backside illuminated global shutter image sensorTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted May 25, 2021·0 cites·20 claims
- 4069US11769781B2Backside illuminated global shutter image sensorTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Sep 26, 2023·0 cites·20 claims
- 4166US10861899B2Interconnect structure for stacked device and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Dec 8, 2020·0 cites·20 claims
- 4264US2024038818A1Semiconductor device and methods of manufacturingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Application pending·0 cites
- 4363US10840287B23DIC interconnect apparatus and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Nov 17, 2020·0 cites·20 claims
- 4462US9147702B2Image sensor for mitigating dark currentTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Sep 29, 2015·0 cites·20 claims
- 4561US10682523B2Interconnect structure and method of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Jun 16, 2020·0 cites·20 claims
- 4661US10510729B23DIC interconnect apparatus and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Dec 17, 2019·0 cites·20 claims
- 4760US10818720B2Stacked image sensor having a barrier layerTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Oct 27, 2020·0 cites·20 claims
- 4860US10763292B2Interconnect apparatus and method for a stacked semiconductor deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Sep 1, 2020·0 cites·20 claims
- 4960US10535697B2Structure and method for 3D Image sensorTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Jan 14, 2020·0 cites·20 claims
- 5060US2025120209A1Image sensor device and method of manufacturing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
Showing the top 50 of 66 patent records by PatentIndex Score.
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