Inventor · disambiguated record
Markus Fink
Also filed as: FINK MARKUS
6 granted patents·2 pending applications·101 citations·filing 2004–2024
82Inventor score
Top patents by PatentIndex Score
8 records- 0190US8106497B2Semiconductor module having a semiconductor chip stack and methodBRUNNBAUER MARKUS·Filed 2007·Granted Jan 31, 2012·25 cites·17 claims
- 0289US7420262B2Electronic component and semiconductor wafer, and method for producing the sameINFINEON TECHNOLOGIES AG·Filed 2004·Granted Sep 2, 2008·52 cites·9 claims
- 0384US7230831B2Heat sink for surface-mounted semiconductor devicesINFINEON TECHNOLOGIES AG·Filed 2005·Granted Jun 12, 2007·20 cites·19 claims
- 0474US8148210B1Method for fabricating a semiconductor chip panelFUERGUT EDWARD·Filed 2010·Granted Apr 3, 2012·4 cites·22 claims
- 0559US2024347427A1Leadframe comprising a lead with an elevation for increasing mechanical robustness and a semiconductor packageINFINEON TECHNOLOGIES AG·Filed 2024·Application pending·0 cites
- 0656US2024413046A1Semiconductor module, power electronic substrate and method for fabricating a semiconductor moduleINFINEON TECHNOLOGIES AG·Filed 2024·Application pending·0 cites
- 0749US8587110B2Semiconductor module having a semiconductor chip stack and methodBRUNNBAUER MARKUS·Filed 2011·Granted Nov 19, 2013·0 cites·15 claims
- 0838US7709379B2Electrical device comprising conductors made of carbonized plastic, and method and apparatus for the production thereofINFINEON TECHNOLOGIES AG·Filed 2004·Granted May 4, 2010·0 cites·6 claims
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