Inventor · disambiguated record
Hendrik Pieter Hochstenbach
Also filed as: HOCHSTENBACH HENDRIK · HOCHSTENBACH HENDRIK P · HOCHSTENBACH HENDRIK PIETER
5 granted patents·1 pending application·39 citations·filing 2003–2010
78Inventor score
Files withNXP BV3HOCHSTENBACH HENDRIK P1HOCHSTENBACH HENDRIK PIETER1VAN VEEN NICOLAAS JOHANNES ANTHONIUS1
Top patents by PatentIndex Score
6 records- 0171US8338967B2Stress buffering package for a semiconductor componentHOCHSTENBACH HENDRIK P·Filed 2007·Granted Dec 25, 2012·8 cites·22 claims
- 0268US8350385B2Reduced bottom roughness of stress buffering element of a semiconductor componentNXP BV·Filed 2008·Granted Jan 8, 2013·5 cites·14 claims
- 0363US7196416B2Electronic device and method of manufacturing sameNXP BV·Filed 2003·Granted Mar 27, 2007·18 cites·11 claims
- 0462US9466579B2Reinforced structure for a stack of layers in a semiconductor componentHOCHSTENBACH HENDRIK PIETER·Filed 2008·Granted Oct 11, 2016·5 cites·17 claims
- 0562US8268672B2Method of assembly and assembly thus madeVAN VEEN NICOLAAS JOHANNES ANTHONIUS·Filed 2005·Granted Sep 18, 2012·3 cites·16 claims
- 0631US2011192885A1Wirebonding processNXP BV·Filed 2010·Application pending·0 cites
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