Inventor · disambiguated record
Koichi Taguchi
Also filed as: TAGUCHI KOICHI
14 granted patents·3 pending applications·113 citations·filing 1991–2022
91Inventor score
Top patents by PatentIndex Score
17 records- 0175US5328947ATwo-part adhesiveDENKI KAGAKU KOGYO KK·Filed 1992·Granted Jul 12, 1994·38 cites·12 claims
- 0264US10438865B2Semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 2016·Granted Oct 8, 2019·1 cites·8 claims
- 0361US12335628B2Imaging condition setting system, imaging condition setting method, and programOMRON TATEISI ELECTRONICS CO·Filed 2021·Granted Jun 17, 2025·0 cites·14 claims
- 0460US5863989ACurable resin compositionDENKI KAGAKU KOGYO KK·Filed 1997·Granted Jan 26, 1999·17 cites·21 claims
- 0558US7772295B2Resin compositions, cured article obtained therefrom, and sheetDENKI KAGAKU KOGYO KK·Filed 2006·Granted Aug 10, 2010·1 cites·6 claims
- 0657US10763183B2Semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 2016·Granted Sep 1, 2020·1 cites·16 claims
- 0754US6420467B1Curable resin composition, adhesive composition, cured product and compositeDENKI KAGAKU KOGYO KK·Filed 1998·Granted Jul 16, 2002·15 cites·16 claims
- 0852US2010294423A1Protective film for laser processing and processing method using the sameDENKI KAGAKU KOGYO KK·Filed 2008·Application pending·0 cites
- 0951US11563380B2Power device drive apparatus and method for manufacturing the sameMITSUBISHI ELECTRIC CORP·Filed 2018·Granted Jan 24, 2023·0 cites·19 claims
- 1049US5330844AAdhesive composition and metal-bonded compositeDENKI KAGAKU KOGYO KK·Filed 1991·Granted Jul 19, 1994·15 cites·12 claims
- 1147US6312552B1Curable resin composition, adhesive composition, bonded product, speaker and bonding methodDENKI KAGAKU KOGYO KK·Filed 2000·Granted Nov 6, 2001·1 cites·9 claims
- 1247US2025149528A1Semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 2022·Application pending·0 cites
- 1343US2010204389A1Resin composition and cured product using it, and sheetDENKI KAGAKU KOGYO KK·Filed 2010·Application pending·0 cites
- 1438US10505518B2Semiconductor device with substrate temperature monitor circuitMITSUBISHI ELECTRIC CORP·Filed 2015·Granted Dec 10, 2019·0 cites·7 claims
- 1534US6166146ACurable resin composition, adhesive composition, bonded product, speaker and bonding methodDENKI KAGAKU KOGYO KK·Filed 1998·Granted Dec 26, 2000·6 cites·9 claims
- 1631USRE36140ETwo-part adhesiveDENKI KAGAKU KOGYO KK·Filed 1996·Granted Mar 9, 1999·5 cites·13 claims
- 1730US5504676ASlip processing method processing data from slips with varying formatsHITACHI LTD·Filed 1994·Granted Apr 2, 1996·13 cites·16 claims
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