Inventor · disambiguated record
Frank W. Kulesza
Also filed as: KULESZA FRANK W
7 granted patents·1,083 citations·filing 1989–1999
91Inventor score
Top patents by PatentIndex Score
7 records- 0198US5196371AFlip chip bonding method using electrically conductive polymer bumpsEPOXY TECHNOLOGY INC·Filed 1991·Granted Mar 23, 1993·251 cites·19 claims
- 0298US5074947AFlip chip technology using electrically conductive polymers and dielectricsEPOXY TECHNOLOGY INC·Filed 1989·Granted Dec 24, 1991·260 cites·16 claims
- 0397US5611140AMethod of forming electrically conductive polymer interconnects on electrical substratesEPOXY TECHNOLOGY INC·Filed 1995·Granted Mar 18, 1997·201 cites·2 claims
- 0497US5237130AFlip chip technology using electrically conductive polymers and dielectricsEPOXY TECHNOLOGY INC·Filed 1991·Granted Aug 17, 1993·207 cites·18 claims
- 0594US6138348AMethod of forming electrically conductive polymer interconnects on electrical substratesPOLYMER FLIP CHIP CORP·Filed 1999·Granted Oct 31, 2000·90 cites·13 claims
- 0687US5879761AMethod for forming electrically conductive polymer interconnects on electrical substratesPOLYMER FLIP CHIP CORP·Filed 1995·Granted Mar 9, 1999·44 cites·7 claims
- 0779US5918364AMethod of forming electrically conductive polymer interconnects on electrical substratesPOLYMER FLIP CHIP CORP·Filed 1997·Granted Jul 6, 1999·30 cites·14 claims
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