Inventor · disambiguated record
Szu-Hung Yang
Also filed as: YANG SZU-HUNG
10 granted patents·124 citations·filing 1998–2022
87Inventor score
Files withTAIWAN SEMICONDUCTOR MFG CO LTD5TAIWAN SEMICONDUCTOR MFG2HUNG CHIA-YANG1LIAO KENG-YING1LIU ZHE-JU1
Top patents by PatentIndex Score
10 records- 0194US9515021B1Semiconductor structure and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Dec 6, 2016·20 cites·20 claims
- 0280US8803271B2Structures for grounding metal shields in backside illumination image sensor chipsLIU ZHE-JU·Filed 2012·Granted Aug 12, 2014·4 cites·20 claims
- 0375US6682659B1Method for forming corrosion inhibited conductor layerTAIWAN SEMICONDUCTOR MFG·Filed 1999·Granted Jan 27, 2004·57 cites·16 claims
- 0468US6686292B1Plasma etch method for forming uniform linewidth residue free patterned composite silicon containing dielectric layer/silicon stack layerTAIWAN SEMICONDUCTOR MFG·Filed 1998·Granted Feb 3, 2004·37 cites·24 claims
- 0567US9040317B2Methods for achieving width control in etching processesLIAO KENG-YING·Filed 2012·Granted May 26, 2015·3 cites·17 claims
- 0666US10957728B2CMOS image sensor structure with crosstalk improvementTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Mar 23, 2021·0 cites·20 claims
- 0764US8872301B2Dual profile shallow trench isolation apparatus and systemHUNG CHIA-YANG·Filed 2012·Granted Oct 28, 2014·3 cites·20 claims
- 0863US12227865B2Plating apparatus and method for electroplating waferTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Feb 18, 2025·0 cites·20 claims
- 0957US11401624B2Plating apparatus and method for electroplating waferTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Aug 2, 2022·0 cites·20 claims
- 1046US10367019B2CMOS image sensor structure with crosstalk improvementTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Jul 30, 2019·0 cites·20 claims
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