Inventor · disambiguated record
Hideki Tsuya
Also filed as: TSUYA HIDEKI
5 granted patents·1 pending application·84 citations·filing 2003–2012
75Inventor score
Top patents by PatentIndex Score
6 records- 0193US7360964B2Joint structureARACO KK·Filed 2004·Granted Apr 22, 2008·70 cites·8 claims
- 0291US8168481B2Method of manufacturing SOI substrateHANAOKA KAZUYA·Filed 2010·Granted May 1, 2012·14 cites·13 claims
- 0349US8486772B2Method of manufacturing SOI substrateHANAOKA KAZUYA·Filed 2012·Granted Jul 16, 2013·0 cites·22 claims
- 0437US8367517B2Method for manufacturing SOI substrateSEMICONDUCTOR ENERGY LAB·Filed 2011·Granted Feb 5, 2013·0 cites·16 claims
- 0535US2013023108A1Method for manufacturing soi substrateSEMICONDUCTOR ENERGY LAB·Filed 2012·Application pending·0 cites
- 0634US7126194B2Method for removing impurities of a semiconductor wafer, semiconductor wafer assembly, and semiconductor deviceJAPAN SOC PROMOTION MACH IND·Filed 2003·Granted Oct 24, 2006·0 cites·22 claims
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