Inventor · disambiguated record
Chiu-Shun Lin
Also filed as: LIN CHIU-SHUN
6 granted patents·2 pending applications·58 citations·filing 2004–2014
80Inventor score
Top patents by PatentIndex Score
8 records- 0185US9450061B2Metal bump structure for use in driver IC and method for forming the sameHIMAX TECH LTD·Filed 2014·Granted Sep 20, 2016·8 cites·16 claims
- 0283US7064449B2Bonding pad and chip structureHIMAX TECH INC·Filed 2004·Granted Jun 20, 2006·41 cites·17 claims
- 0365US7449770B2Substrate with slotHIMAX TECH INC·Filed 2006·Granted Nov 11, 2008·3 cites·6 claims
- 0464US7906374B2COF packaging structure, method of manufacturing the COF packaging structure, and method for assembling a driver IC and the COF packaging structure thereofHIMAX TECH LTD·Filed 2008·Granted Mar 15, 2011·3 cites·4 claims
- 0560US10128348B2Metal bump structure for use in driver IC and method for forming the sameHIMAX TECH LTD·Filed 2014·Granted Nov 13, 2018·1 cites·25 claims
- 0652US8618678B2Chip structure and chip package structureLIN CHIU-SHUN·Filed 2008·Granted Dec 31, 2013·2 cites·7 claims
- 0737US2009091028A1Semiconductor device and method of bump formationHIMAX TECH LTD·Filed 2008·Application pending·0 cites
- 0833US2010264522A1Semiconductor device having at least one bump without overlapping specific pad or directly contacting specific padCHEN CHIEN-PIN·Filed 2010·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →