Inventor · disambiguated record
Takeshi Nishio
Also filed as: NISHIO TAKESHI
5 granted patents·11 pending applications·198 citations·filing 1994–2022
78Inventor score
Top patents by PatentIndex Score
16 records- 0194US5430293AGas visualizing apparatus and method for detecting gas leakage from tanks or pipingOSAKA GAS CO LTD·Filed 1994·Granted Jul 4, 1995·177 cites·9 claims
- 0267US7092994B2System, method and apparatus for updating electronic mail recipient listsIBM·Filed 2002·Granted Aug 15, 2006·16 cites·19 claims
- 0366US2025122316A1Curable composition and cured productDEXERIALS CORP·Filed 2022·Application pending·0 cites
- 0465US2023279217A1Cationic curing agent, method for producing same and cationically curable compositionDEXERIALS CORP·Filed 2022·Application pending·0 cites
- 0563US12240942B2Cationic curing agent, method for producing same and cationically curable compositionDEXERIALS CORP·Filed 2020·Granted Mar 4, 2025·0 cites·16 claims
- 0663US2025128361A1Solder particle manufacturing method, solder particle, and conductive compositionDEXERIALS CORP·Filed 2022·Application pending·0 cites
- 0761US5641617APhotographic material for laser scan exposureFUJI PHOTO FILM CO LTD·Filed 1995·Granted Jun 24, 1997·5 cites·3 claims
- 0860US2025001528A1Solder particles, solder particle production method, and conductive compositionDEXERIALS CORP·Filed 2022·Application pending·0 cites
- 0959US2024367270A1Solder particles, method for producing solder particles, and conductive compositionDEXERIALS CORP·Filed 2022·Application pending·0 cites
- 1056US2024266086A1Composite conductive particle and method for manufacturing composite conductive particleDEXERIALS CORP·Filed 2021·Application pending·0 cites
- 1149US2019194454A1Compound, Cationic Curing Agent, and Cationic Curable CompositionDEXERIALS CORP·Filed 2018·Application pending·0 cites
- 1249US2004091888A1Method for identification of S genotype in brassicaceaeFiled 2003·Application pending·0 cites
- 1348US11976769B2Oil leakage repairing material, oil leakage repairing method, and pipeDEXERIALS CORP·Filed 2019·Granted May 7, 2024·0 cites·5 claims
- 1448US2023015183A1Repairing component including micro-led chip and production method thereof, repairing method, method for producing light emitting device, and light emitting deviceDEXERIALS CORP·Filed 2021·Application pending·0 cites
- 1547US2024384147A1Thermally conductive composition and thermally conductive sheetDEXERIALS CORP·Filed 2022·Application pending·0 cites
- 1640US2004161414A1Method of curing injured spinal cord and therapeutic agents for thatFiled 2004·Application pending·0 cites
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