Inventor · disambiguated record
Toshihiko Kitamura
Also filed as: KITAMURA TOSHIHIKO
8 granted patents·3 pending applications·30 citations·filing 1997–2024
80Inventor score
Top patents by PatentIndex Score
11 records- 0187US7432530B2Solid-state imaging device and method of manufacturing sameTOSHIBA KK·Filed 2007·Granted Oct 7, 2008·10 cites·14 claims
- 0272US2024405130A1Wiring board, electronic component package, and electronic apparatusKYOCERA CORP·Filed 2024·Application pending·0 cites
- 0371US7550792B2Solid-state imaging device and manufacturing method thereofTOSHIBA KK·Filed 2007·Granted Jun 23, 2009·2 cites·12 claims
- 0470US10512155B2Wiring board, optical semiconductor element package, and optical semiconductor deviceKYOCERA CORP·Filed 2017·Granted Dec 17, 2019·2 cites·6 claims
- 0560US12068420B2Wiring board, electronic component package, and electronic apparatusKYOCERA CORP·Filed 2020·Granted Aug 20, 2024·0 cites·13 claims
- 0650US12322700B2Wiring base and electronic deviceKYOCERA CORP·Filed 2021·Granted Jun 3, 2025·0 cites·12 claims
- 0750US6015754AChemical mechanical polishing apparatus and methodTOSHIBA KK·Filed 1997·Granted Jan 18, 2000·16 cites·20 claims
- 0850US2024243055A1Electronic-component mounting package and electronic deviceKYOCERA CORP·Filed 2022·Application pending·0 cites
- 0949US11889618B2Wiring board, electronic component package, and electronic apparatusKYOCERA CORP·Filed 2020·Granted Jan 30, 2024·0 cites·17 claims
- 1047US2007052056A1Solid-state imaging device and method of manufacturing sameTOSHIBA KK·Filed 2006·Application pending·0 cites
- 1142US9443777B2Semiconductor element housing package, semiconductor device, and mounting structureKYOCERA CORP·Filed 2013·Granted Sep 13, 2016·0 cites·5 claims
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →