Inventor · disambiguated record
Naoki Murazawa
Also filed as: MURAZAWA NAOKI
5 granted patents·5 pending applications·6 citations·filing 2015–2025
67Inventor score
Files withDISCO CORP10
Top patents by PatentIndex Score
10 records- 0184US10852240B2Facet region detecting method and detecting apparatusDISCO CORP·Filed 2019·Granted Dec 1, 2020·4 cites·8 claims
- 0280US11340163B2Method and apparatus for detecting facet region, wafer producing method, and laser processing apparatusDISCO CORP·Filed 2019·Granted May 24, 2022·2 cites·2 claims
- 0363US2022236185A1Method and apparatus for detecting facet region, wafer producing method, and laser processing apparatusDISCO CORP·Filed 2022·Application pending·0 cites
- 0459US2025059681A1Method of processing carbon-contained monocrystalline substrateDISCO CORP·Filed 2024·Application pending·0 cites
- 0556US12270790B2Inspection apparatusDISCO CORP·Filed 2023·Granted Apr 8, 2025·0 cites·4 claims
- 0652US11892282B2Protective film thickness measuring methodDISCO CORP·Filed 2022·Granted Feb 6, 2024·0 cites·11 claims
- 0752US2024001490A1Diamond substrate manufacturing methodDISCO CORP·Filed 2023·Application pending·0 cites
- 0848US2025243105A1Method for manufacturing molded articleDISCO CORP·Filed 2025·Application pending·0 cites
- 0946US11110549B2Recess or through-hole forming method and electrode forming methodDISCO CORP·Filed 2018·Granted Sep 7, 2021·0 cites·6 claims
- 1033US2016172182A1Laser processing apparatusDISCO CORP·Filed 2015·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →