Inventor · disambiguated record
Sung Woo Hyun
Also filed as: HYUN SUNG WOO
10 granted patents·6 pending applications·22 citations·filing 2007–2025
82Inventor score
Top patents by PatentIndex Score
16 records- 0192US8236673B2Methods of fabricating vertical semiconductor device utilizing phase changes in semiconductor materialsSON YONG-HOON·Filed 2011·Granted Aug 7, 2012·14 cites·20 claims
- 0275US2025306806A1Memory module, memory system including memory module, and method of operating the sameSK HYNIX INC·Filed 2025·Application pending·0 cites
- 0374US9112055B2Semiconductor device and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2013·Granted Aug 18, 2015·3 cites·15 claims
- 0471US2024394189A1Memory system and host deviceSK HYNIX INC·Filed 2024·Application pending·0 cites
- 0570US12086068B2Memory system and host deviceSK HYNIX INC·Filed 2023·Granted Sep 10, 2024·0 cites·20 claims
- 0669US12346600B2Memory module, memory system including memory module, and method of operating the sameSK HYNIX INC·Filed 2022·Granted Jul 1, 2025·0 cites·20 claims
- 0764US12399623B2Memory module and method of operating the sameSK HYNIX INC·Filed 2023·Granted Aug 26, 2025·0 cites·19 claims
- 0863US12019545B2Memory system and operating method thereofSK HYNIX INC·Filed 2022·Granted Jun 25, 2024·0 cites·20 claims
- 0962US8604551B2Semiconductor device including trenches having particular structuresSAMSUNG ELECTRONICS CO LTD·Filed 2013·Granted Dec 10, 2013·1 cites·4 claims
- 1056US2024385968A1Memory module, memory system including memory module, and method of operating the sameSK HYNIX INC·Filed 2024·Application pending·0 cites
- 1156US2024385967A1Memory module, memory system including memory module, and method of operating the sameSK HYNIX INC·Filed 2024·Application pending·0 cites
- 1256US2024385969A1Memory module, memory system including memory module, and method of operating the sameSK HYNIX INC·Filed 2024·Application pending·0 cites
- 1355US12216588B2Semiconductor memory apparatus, memory module, and memory system including memory moduleSK HYNIX INC·Filed 2021·Granted Feb 4, 2025·0 cites·17 claims
- 1455US8415224B2Method of fabricating a semiconductor device including forming trenches having particular structuresHYUN SUNG-WOO·Filed 2011·Granted Apr 9, 2013·1 cites·16 claims
- 1555US8120045B2Metal-based photonic device package moduleKWON YOUNG-SE·Filed 2007·Granted Feb 21, 2012·3 cites·17 claims
- 1632US2011177671A1Methods of forming a semiconductor cell array region, method of forming a semiconductor device including the semiconductor cell array region, and method of forming a semiconductor module including the semiconductor deviceHYUN SUNG-WOO·Filed 2010·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →