Inventor · disambiguated record
Hsin-Kuan Wu
Also filed as: WU HSIN-KUAN
6 granted patents·1 pending application·7 citations·filing 2005–2020
71Inventor score
Files withSHANGHAI ZHAOXIN SEMICONDUCTOR CO LTD2VIA TECH INC2HONGFUJIN PREC IND WUHAN1WU HSIN-KUAN1WU NING1
Top patents by PatentIndex Score
7 records- 0162US9042116B2Printed circuit board with daughterboardHONGFUJIN PREC IND WUHAN·Filed 2013·Granted May 26, 2015·1 cites·2 claims
- 0261US8498128B2Printed circuit boardWU NING·Filed 2010·Granted Jul 30, 2013·3 cites·3 claims
- 0359US11362464B2Contact arrangement, circuit board, and electronic assemblySHANGHAI ZHAOXIN SEMICONDUCTOR CO LTD·Filed 2020·Granted Jun 14, 2022·0 cites·19 claims
- 0459US11316305B2Contact arrangement, circuit board, and electronic assemblySHANGHAI ZHAOXIN SEMICONDUCTOR CO LTD·Filed 2020·Granted Apr 26, 2022·0 cites·20 claims
- 0556US7279913B2Testing assembly for electrical test of electronic package and testing socket thereofVIA TECH INC·Filed 2005·Granted Oct 9, 2007·3 cites·11 claims
- 0638US2012310609A1Method for controlling impedanceWU HSIN-KUAN·Filed 2011·Application pending·0 cites
- 0736US7586320B2Plunger and chip-testing module applying the sameVIA TECH INC·Filed 2006·Granted Sep 8, 2009·0 cites·7 claims
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →