Inventor · disambiguated record
Albrecht Kieslich
Also filed as: KIESLICH ALBRECHT
13 granted patents·2 pending applications·69 citations·filing 2000–2018
89Inventor score
Top patents by PatentIndex Score
15 records- 0170US6737748B2Stacked via with specially designed landing pad for integrated semiconductor structuresINFINEON TECHNOLOGIES AG·Filed 2002·Granted May 18, 2004·19 cites·18 claims
- 0268US6368940B1Method for fabricating a microelectronic structureINFINEON TECHNOLOGIES AG·Filed 2000·Granted Apr 9, 2002·18 cites·11 claims
- 0362US9825198B2Method of producing a plurality of optoelectronic semiconductor chips, and optoelectronic semiconductor chipOSRAM OPTO SEMICONDUCTORS GMBH·Filed 2012·Granted Nov 21, 2017·1 cites·10 claims
- 0462US7217610B2Method for fabricating a semiconductor product with a memory area and a logic areaINFINEON TECHNOLOGIES AG·Filed 2002·Granted May 15, 2007·8 cites·16 claims
- 0554US6753236B2Method for planarizing an isolating layerINFINEON TECHNOLOGIES AG·Filed 2002·Granted Jun 22, 2004·7 cites·19 claims
- 0651US6849364B2Mask for fabricating semiconductor componentsINFINEON TECHNOLOGIES AG·Filed 2002·Granted Feb 1, 2005·3 cites·12 claims
- 0750US7259060B2Method for fabricating a semiconductor structureINFINEON TECHNOLOGIES AG·Filed 2004·Granted Aug 21, 2007·3 cites·10 claims
- 0850US6638814B1Method for producing an insulationINFINEON TECHNOLOGIES AG·Filed 2000·Granted Oct 28, 2003·5 cites·16 claims
- 0943US6750112B2Method of forming a bitline and a bitline contact, and dynamic memory cell including a bitline and bitline made contact according to the methodINFINEON TECHNOLOGIES AG·Filed 2002·Granted Jun 15, 2004·2 cites·11 claims
- 1043US6559547B1Patterning of content areas in multilayer metalization configurations of semiconductor componentsINFINEON TECHNOLOGIES AG·Filed 2000·Granted May 6, 2003·2 cites·12 claims
- 1141US11476389B2Method for producing an optoelectronic semiconductor chip having structures at the radiation passage surface, and optoelectronic semiconductor chip having structures at the radiation passage surfaceOSRAM OLED GMBH·Filed 2018·Granted Oct 18, 2022·0 cites·17 claims
- 1240US6864170B2Compact semiconductor structureINFINEON TECHNOLOGIES AG·Filed 2001·Granted Mar 8, 2005·1 cites·3 claims
- 1339US2005196689A1Method for transferring a layout of an integrated circuit level to a semiconductor substrateFiled 2005·Application pending·0 cites
- 1431US7189614B2Method for fabricating a trench structure which is electrically connected to a substrate on one side via a buried contactINFINEON TECHNOLOGIES AG·Filed 2004·Granted Mar 13, 2007·0 cites·8 claims
- 1523US2002039819A1Method for manufacturing a field effect transistorFiled 2001·Application pending·0 cites
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