Inventor · disambiguated record
Tae-Koo Lee
Also filed as: LEE TAE-KOO
4 granted patents·120 citations·filing 1995–2003
80Inventor score
Technology areasH10W
Files withSAMSUNG ELECTRONICS CO LTD4
Top patents by PatentIndex Score
4 records- 0189US6835598B2Stacked semiconductor module and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2003·Granted Dec 28, 2004·61 cites·28 claims
- 0271US6781849B2Multi-chip package having improved heat spread characteristics and method for manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2003·Granted Aug 24, 2004·18 cites·24 claims
- 0359US5660318AApparatus for inner lead bonding (ILB) comprising a heat dissipation pin and method of ILB using such an apparatusSAMSUNG ELECTRONICS CO LTD·Filed 1995·Granted Aug 26, 1997·29 cites·12 claims
- 0443US6326686B1Vertical semiconductor device package having printed circuit board and heat spreader, and module having the packagesSAMSUNG ELECTRONICS CO LTD·Filed 1998·Granted Dec 4, 2001·12 cites·28 claims
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