Inventor · disambiguated record
Jin-Yang Lee
Also filed as: LEE JIN-YANG
5 granted patents·3 pending applications·124 citations·filing 2003–2011
82Inventor score
Technology areasH10W
Top patents by PatentIndex Score
8 records- 0190US7301233B2Semiconductor chip package with thermoelectric coolerSAMSUNG ELECTRONICS CO LTD·Filed 2005·Granted Nov 27, 2007·22 cites·20 claims
- 0289US6835598B2Stacked semiconductor module and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2003·Granted Dec 28, 2004·61 cites·28 claims
- 0384US7345882B2Semiconductor module with heat sink and method thereofSAMSUNG ELECTRONICS CO LTD·Filed 2004·Granted Mar 18, 2008·35 cites·23 claims
- 0468US8487452B2Semiconductor package having a stacked structureLEE JIN-YANG·Filed 2011·Granted Jul 16, 2013·4 cites·17 claims
- 0562US7485006B2Memory module, socket and mounting method providing improved heat dissipating characteristicsSAMSUNG ELECTRONICS CO LTD·Filed 2005·Granted Feb 3, 2009·2 cites·18 claims
- 0650US2009130908A1Memory module, socket and mounting method providing improved heat dissipating characteristicsPARK SANG-WOOK·Filed 2008·Application pending·0 cites
- 0743US2008144292A1Semiconductor module with heat sink and method thereofLEE HAE-HYUNG·Filed 2008·Application pending·0 cites
- 0834US2006006517A1Multi-chip package having heat dissipating pathLEE JIN-YANG·Filed 2005·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →