Inventor · disambiguated record
Chin-Wen Lai
Also filed as: LAI CHIN-WEN
1 granted patent·4 pending applications·36 citations·filing 2001–2024
48Inventor score
Technology areasH10W
Files withSILICONWARE PRECISION INDUSTRIES CO LTD5
Top patents by PatentIndex Score
5 records- 0178US6617680B2Chip carrier, semiconductor package and fabricating method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2001·Granted Sep 9, 2003·36 cites·14 claims
- 0260US2025183109A1Electronic package and manufacturing method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2024·Application pending·0 cites
- 0356US2025174582A1Electronic package and manufacturing method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2024·Application pending·0 cites
- 0455US2025349678A1Lead frame and manufacturing method of electronic package using the sameSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2024·Application pending·0 cites
- 0536US2004072389A1Chip carrier, semiconductor package and fabricating method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2003·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →