Inventor · disambiguated record
Eddy Roelants
Also filed as: ROELANTS EDDY
11 granted patents·210 citations·filing 1990–2003
91Inventor score
Top patents by PatentIndex Score
11 records- 0186US6610960B2Method for drilling micro-holes with a laser beamSIEMENS AG·Filed 2002·Granted Aug 26, 2003·49 cites·18 claims
- 0284US6678061B2Method of calibrating the optical system of a laser machine for processing electrical circuit substratesSIEMENS AG·Filed 2002·Granted Jan 13, 2004·46 cites·14 claims
- 0379US6437283B1Device and method for processing substratesSIEMENS AG·Filed 2000·Granted Aug 20, 2002·29 cites·14 claims
- 0470US6649864B2Method of laser drillingSIEMENS AG·Filed 2002·Granted Nov 18, 2003·20 cites·19 claims
- 0569US6531679B2Method for the laser machining of organic materialsSIEMENS AG·Filed 2001·Granted Mar 11, 2003·13 cites·17 claims
- 0665US6781092B2Method for drilling holes in a substrateSIEMENS AG·Filed 2003·Granted Aug 24, 2004·16 cites·22 claims
- 0757US5134056AMethod for applying a solder resist layer to a printed circuit boardSIEMENS AG·Filed 1990·Granted Jul 28, 1992·23 cites·21 claims
- 0855US6833528B2Method and apparatus for laser processingSIEMENS AG·Filed 2003·Granted Dec 21, 2004·5 cites·32 claims
- 0952US6849823B2Arrangement and method for processing electrical substrates using lasersSIEMENS AG·Filed 2003·Granted Feb 1, 2005·7 cites·23 claims
- 1046US6576402B2Method for producing wiring configurations having coarse conductor structures and at least one region having fine conductor structuresSIEMENS PRODUCTION & LOGISTICS·Filed 2001·Granted Jun 10, 2003·2 cites·8 claims
- 1138US6783688B2Method and apparatus for structuring printed circuit boardsSIEMENS AG·Filed 2002·Granted Aug 31, 2004·0 cites·8 claims
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