Inventor · disambiguated record
Sung Ho Hyun
Also filed as: HYUN SUNG HO
6 granted patents·1 pending application·4 citations·filing 2008–2018
70Inventor score
Top patents by PatentIndex Score
7 records- 0164US8823183B2Bump for semiconductor package, semiconductor package having bump, and stacked semiconductor packageKIM KI YOUNG·Filed 2010·Granted Sep 2, 2014·2 cites·17 claims
- 0260US8399998B2Semiconductor package requiring reduced manufacturing processesKIM KI YOUNG·Filed 2009·Granted Mar 19, 2013·2 cites·15 claims
- 0352US10741529B2Semiconductor packagesSK HYNIX INC·Filed 2018·Granted Aug 11, 2020·0 cites·18 claims
- 0446US10224314B2Semiconductor packagesSK HYNIX INC·Filed 2016·Granted Mar 5, 2019·0 cites·20 claims
- 0545US7800201B2Thinned wafer having stress dispersion parts and method for manufacturing semiconductor package using the sameHYNIX SEMICONDUCTOR INC·Filed 2008·Granted Sep 21, 2010·0 cites·14 claims
- 0643US8829689B2Module substrate with feature for replacement of faulty chips, semiconductor module having the same, and method for manufacturing the semiconductor moduleKIM KI YOUNG·Filed 2010·Granted Sep 9, 2014·0 cites·13 claims
- 0733US2012112342A1Semiconductor device and stacked semiconductor packageHYUN SUNG HO·Filed 2011·Application pending·0 cites
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