Inventor · disambiguated record
Kai Siu Lam
Also filed as: LAM Kai Siu
6 granted patents·1 pending application·0 citations·filing 2015–2023
63Inventor score
Top patents by PatentIndex Score
7 records- 0150US2024264524A1Combined dispensing and stamping apparatus and method for applying adhesive fluid during a bonding processASMPT SINGAPORE PTE LTD·Filed 2023·Application pending·0 cites
- 0245US9989587B2Apparatus for testing multiple semiconductor dice with increased throughputASM TECH SINGAPORE PTE LTD·Filed 2015·Granted Jun 5, 2018·0 cites·17 claims
- 0344US11136202B2Direct transfer apparatus for electronic componentsASM TECH SINGAPORE PTE LTD·Filed 2020·Granted Oct 5, 2021·0 cites·16 claims
- 0440US11056377B2Collet inspection in a semiconductor pick and place apparatusASM TECH SINGAPORE PTE LTD·Filed 2019·Granted Jul 6, 2021·0 cites·19 claims
- 0540US10684118B1Apparatus for determining an orientation of a dieASM TECH SINGAPORE PTE LTD·Filed 2019·Granted Jun 16, 2020·0 cites·17 claims
- 0638US10014203B2Pick and place device comprising pick arm correction moduleASM TECH SINGAPORE PTE LTD·Filed 2016·Granted Jul 3, 2018·0 cites·20 claims
- 0731US10192761B2Pick arm comprising a winged part for a bonding apparatusASM TECH SINGAPORE PTE LTD·Filed 2017·Granted Jan 29, 2019·0 cites·13 claims
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