Inventor · disambiguated record
Wing Chiu Lai
Also filed as: LAI WING CHIU · LAI WING CHIU DEREK
5 granted patents·1 pending application·10 citations·filing 2006–2017
69Inventor score
Top patents by PatentIndex Score
6 records- 0172US7667355B2Apparatus for generating amplified cooling air flowsASM ASSEMBLY AUTOMATION LTD·Filed 2008·Granted Feb 23, 2010·7 cites·11 claims
- 0258US10312214B2Atomization mechanism for cooling a bond headASM TECH SINGAPORE PTE LTD·Filed 2016·Granted Jun 4, 2019·1 cites·18 claims
- 0354US7514825B2Linear motor cooling apparatus with air amplificationASM ASSEMBLY AUTOMATION LTD·Filed 2006·Granted Apr 7, 2009·2 cites·18 claims
- 0446US2009056761A1Apparatus for maintaining a clean bonding enviromentAU PO LAM BENNY·Filed 2007·Application pending·0 cites
- 0531US10475763B2Die bonding apparatus comprising an inert gas environmentASM TECH SINGAPORE PTE LTD·Filed 2016·Granted Nov 12, 2019·0 cites·16 claims
- 0631US10192761B2Pick arm comprising a winged part for a bonding apparatusASM TECH SINGAPORE PTE LTD·Filed 2017·Granted Jan 29, 2019·0 cites·13 claims
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