Inventor · disambiguated record
Arden L. Moore
Also filed as: MOORE ARDEN · MOORE ARDEN L · MOORE ARDEN LOT
19 granted patents·3 pending applications·92 citations·filing 2012–2025
93Inventor score
Files withIBM17LOUISIANA TECH RES CORPORATION2KUCZYNSKI JOSEPH1LOUISIANA TECH RESEARCH CORPORATION OF LOUISIANA TECH UNIV FOUNDATION INC1MASHAK BENJAMIN WILLIAM1
Top patents by PatentIndex Score
22 records- 0197US8911244B2Receptacle with heat management for electronic and optical systemsIBM·Filed 2012·Granted Dec 16, 2014·44 cites·8 claims
- 0291US10781351B1Hexagonal boron nitride thermal conductivity enhancing materials and method of makingLOUISIANA TECH RES CORPORATION·Filed 2017·Granted Sep 22, 2020·4 cites·14 claims
- 0385US9243943B2Air-flow sensor for adapter slots in a data processing systemIBM·Filed 2013·Granted Jan 26, 2016·8 cites·14 claims
- 0485US8764405B2Dynamic compensation of airflow in electronics enclosures with failed fansIBM·Filed 2013·Granted Jul 1, 2014·6 cites·9 claims
- 0584US9261930B2Electronics enclosure with redundant thermal sensing architectureIBM·Filed 2013·Granted Feb 16, 2016·6 cites·5 claims
- 0683US9482349B2Air valve for electronics enclosuresIBM·Filed 2014·Granted Nov 1, 2016·6 cites·10 claims
- 0782US9523432B2Air valve for electronics enclosuresIBM·Filed 2015·Granted Dec 20, 2016·3 cites·10 claims
- 0882US9090004B2Composites comprised of aligned carbon fibers in chain-aligned polymer binderIBM·Filed 2013·Granted Jul 28, 2015·5 cites·16 claims
- 0979US9513678B2Electronics enclosure with redundant thermal sensing architectureIBM·Filed 2016·Granted Dec 6, 2016·2 cites·18 claims
- 1074US8936443B2Dynamic compensation of airflow in electronics enclosures with failed fansMASHAK BENJAMIN WILLIAM·Filed 2012·Granted Jan 20, 2015·4 cites·16 claims
- 1169US9326386B2Computer system component bayIBM·Filed 2013·Granted Apr 26, 2016·2 cites·17 claims
- 1266US9470567B2Techniques for calibrating an air-flow sensor for adapter slots in a data processing systemIBM·Filed 2013·Granted Oct 18, 2016·2 cites·13 claims
- 1362US9296246B2Anti-counterfeiting opto-thermal watermark for electronicsIBM·Filed 2013·Granted Mar 29, 2016·0 cites·6 claims
- 1460US9277677B2Cooling an electronic device using a thermally conductive loopIBM·Filed 2013·Granted Mar 1, 2016·0 cites·9 claims
- 1560US9265179B2Continuous loop cooling for an electronic deviceIBM·Filed 2013·Granted Feb 16, 2016·0 cites·8 claims
- 1659US2025318080A1Direct liquid contact electronics cooling system with multimode functionalityLOUISIANA TECH RESEARCH CORPORATION OF LOUISIANA TECH UNIV FOUNDATION INC·Filed 2025·Application pending·0 cites
- 1756US10139873B2Electronics enclosure with redundant thermal sensing architectureIBM·Filed 2013·Granted Nov 27, 2018·0 cites·13 claims
- 1855US9921619B2Method for containing computer system componentsIBM·Filed 2016·Granted Mar 20, 2018·0 cites·7 claims
- 1950US9233572B2Anti-counterfeiting opto-thermal watermark for electronicsIBM·Filed 2013·Granted Jan 12, 2016·0 cites·13 claims
- 2045US11644364B1High temperature thermal sensorsLOUISIANA TECH RES CORPORATION·Filed 2019·Granted May 9, 2023·0 cites·21 claims
- 2145US2016358839A1Composites comprised of aligned carbon fibers in chain-aligned polymer binderKUCZYNSKI JOSEPH·Filed 2015·Application pending·0 cites
- 2243US2015092349A1Implementing redundant and high efficiency hybrid liquid and air cooling for chipstacksIBM·Filed 2013·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →