Inventor · disambiguated record
Sang Hyuck Nam
Also filed as: NAM SANG CHEOL · NAM SANG HYUCK
5 granted patents·8 pending applications·52 citations·filing 2001–2023
73Inventor score
Top patents by PatentIndex Score
13 records- 0187US7208341B2Method for manufacturing printed circuit boardLG ELECTRONICS INC·Filed 2004·Granted Apr 24, 2007·48 cites·7 claims
- 0280US12160955B2Circuit boardLG INNOTEK CO LTD·Filed 2021·Granted Dec 3, 2024·1 cites·16 claims
- 0371US9629248B2Embedded printed circuit boardLG INNOTEK CO LTD·Filed 2015·Granted Apr 18, 2017·3 cites·19 claims
- 0463US12156339B2Camera moduleLG INNOTEK CO LTD·Filed 2021·Granted Nov 26, 2024·0 cites·19 claims
- 0556US12349288B2Circuit board including a core layer provided with plurality of insulating layersLG INNOTEK CO LTD·Filed 2023·Granted Jul 1, 2025·0 cites·17 claims
- 0655US2025329625A1Circuit board and semiconductor package comprising sameLG INNOTEK CO LTD·Filed 2023·Application pending·0 cites
- 0746US2024339413A1Circuit board and semiconductor package comprising sameLG INNOTEK CO LTD·Filed 2022·Application pending·0 cites
- 0846US2025185160A1Circuit board and semiconductor package comprising sameLG INNOTEK CO LTD·Filed 2022·Application pending·0 cites
- 0946US2023413425A1Circuit boardLG INNOTEK CO LTD·Filed 2021·Application pending·0 cites
- 1044US2024349419A1Circuit board and semiconductor package comprising sameLG INNOTEK CO LTD·Filed 2022·Application pending·0 cites
- 1141US2024258223A1Circuit board and semiconductor package comprising sameLG INNOTEK CO LTD·Filed 2022·Application pending·0 cites
- 1234US2002032743A1Method for providing e-mail serviceLG ELECTRONICS INC·Filed 2001·Application pending·0 cites
- 1332US2016351543A1Printed circuit board, package substrate and production method for sameLG INNOTEK CO LTD·Filed 2015·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →