Inventor · disambiguated record
Taisuke Ahiko
Also filed as: AHIKO TAISUKE
28 granted patents·1 pending application·1,099 citations·filing 1998–2007
98Inventor score
Files withTDK CORP29
Top patents by PatentIndex Score
29 records- 0198US6292351B1Multilayer ceramic capacitor for three-dimensional mountingTDK CORP·Filed 2000·Granted Sep 18, 2001·186 cites·15 claims
- 0297US7050288B2Laminated ceramic capacitorTDK CORP·Filed 2005·Granted May 23, 2006·65 cites·10 claims
- 0394US6407906B1Multiterminal-multilayer ceramic capacitorTDK CORP·Filed 2000·Granted Jun 18, 2002·80 cites·15 claims
- 0494US6407907B1Multilayer ceramic capacitorTDK CORP·Filed 2000·Granted Jun 18, 2002·94 cites·5 claims
- 0593US6999300B2Multilayer capacitorTDK CORP·Filed 2005·Granted Feb 14, 2006·18 cites·20 claims
- 0692US7224572B2Multilayer capacitorTDK CORP·Filed 2006·Granted May 29, 2007·17 cites·6 claims
- 0792US6441459B1Multilayer electronic device and method for producing sameTDK CORP·Filed 2000·Granted Aug 27, 2002·72 cites·10 claims
- 0891US7304831B2Ceramic electronic component and multilayer capacitorTDK CORP·Filed 2006·Granted Dec 4, 2007·23 cites·10 claims
- 0990US7312975B2Laminated capacitor and manufacturing method thereofTDK CORP·Filed 2006·Granted Dec 25, 2007·19 cites·10 claims
- 1090US6452781B1Multilayer electronic deviceTDK CORP·Filed 2001·Granted Sep 17, 2002·56 cites·8 claims
- 1188US6958899B2Electronic deviceTDK CORP·Filed 2004·Granted Oct 25, 2005·45 cites·21 claims
- 1288US6657848B2Multilayer electronic device and method for producing sameTDK CORP·Filed 2002·Granted Dec 2, 2003·49 cites·16 claims
- 1388US6576497B2Chip-type electronic componentTDK CORP·Filed 2001·Granted Jun 10, 2003·34 cites·5 claims
- 1487US7099138B1Multilayer capacitorTDK CORP·Filed 2006·Granted Aug 29, 2006·16 cites·21 claims
- 1586US7735713B2Method for mounting chip component and circuit boardTDK CORP·Filed 2006·Granted Jun 15, 2010·16 cites·4 claims
- 1686US6104599AChip type laminated ceramic capacitorTDK CORP·Filed 1998·Granted Aug 15, 2000·115 cites·2 claims
- 1785US6380619B2Chip-type electronic component having external electrodes that are spaced at predetermined distances from side surfaces of a ceramic substrateTDK CORP·Filed 1999·Granted Apr 30, 2002·80 cites·18 claims
- 1882US7196897B2Multilayer capacitorTDK CORP·Filed 2006·Granted Mar 27, 2007·8 cites·8 claims
- 1981US7298604B2Multilayer capacitor and method of adjusting equivalent series resistance of multilayer capacitorTDK CORP·Filed 2006·Granted Nov 20, 2007·11 cites·36 claims
- 2081US6807047B2Electronic device and interposer boardTDK CORP·Filed 2003·Granted Oct 19, 2004·25 cites·14 claims
- 2180US7584853B2Electronic component seriesTDK CORP·Filed 2005·Granted Sep 8, 2009·12 cites·6 claims
- 2279US7177138B2Chip-type electronic componentTDK CORP·Filed 2005·Granted Feb 13, 2007·12 cites·6 claims
- 2377US7224569B2Multilayer capacitorTDK CORP·Filed 2006·Granted May 29, 2007·6 cites·9 claims
- 2475US7075774B2Multilayer capacitorTDK CORP·Filed 2003·Granted Jul 11, 2006·16 cites·9 claims
- 2574US7586174B2Multilayer capacitorTDK CORP·Filed 2006·Granted Sep 8, 2009·7 cites·10 claims
- 2674US7388737B2Multilayer capacitor and method of adjusting equivalent series resistance of multilayer capacitorTDK CORP·Filed 2005·Granted Jun 17, 2008·7 cites·16 claims
- 2769US7339781B2Electronic component and electronic deviceTDK CORP·Filed 2006·Granted Mar 4, 2008·7 cites·2 claims
- 2862US7391219B2Chip type electronic component for test, and mounted state test methodTDK CORP·Filed 2007·Granted Jun 24, 2008·3 cites·3 claims
- 2936US2003011963A1Multiterminal multilayer ceramic electronic deviceTDK CORP·Filed 2002·Application pending·0 cites
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