Inventor · disambiguated record
Kuang-Neng Chung
Also filed as: CHUNG KUANG-NENG
2 granted patents·1 pending application·2 citations·filing 2011–2014
34Inventor score
Technology areasH10W
Top patents by PatentIndex Score
3 records- 0162US9257394B2Shield, package structure and semiconductor package having the shield and fabrication method of the semiconductor packageSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2013·Granted Feb 9, 2016·2 cites·20 claims
- 0242US9526171B2Package structure and fabrication method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2014·Granted Dec 20, 2016·0 cites·11 claims
- 0332US2012170162A1Semiconductor package and fabrication method thereofFANG HAO-JU·Filed 2011·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →