Inventor · disambiguated record
Tetsu Takemasa
Also filed as: TAKEMASA Tetsu
6 granted patents·1 pending application·0 citations·filing 2015–2023
64Inventor score
Top patents by PatentIndex Score
7 records- 0171US12502735B2Flux and solder pasteSENJU METAL INDUSTRY CO·Filed 2023·Granted Dec 23, 2025·0 cites·6 claims
- 0270US12479051B2Flux and solder pasteSENJU METAL INDUSTRY CO·Filed 2023·Granted Nov 25, 2025·0 cites·10 claims
- 0363US11628519B2Solder jointLENOVO SINGAPORE PTE LTD·Filed 2021·Granted Apr 18, 2023·0 cites·6 claims
- 0450US11097379B2Solder bonding method and solder jointLENOVO SINGAPORE PTE LTD·Filed 2019·Granted Aug 24, 2021·0 cites·7 claims
- 0541US11710580B2Electrically conductive paste and sintered bodySENJU METAL INDUSTRY CO·Filed 2019·Granted Jul 25, 2023·0 cites·20 claims
- 0639US11024598B2Metallic sintered bonding body and die bonding methodSENJU METAL INDUSTRY CO·Filed 2017·Granted Jun 1, 2021·0 cites·17 claims
- 0736US2017304961A1Solder Paste and Solder JointSENJU METAL INDUSTRY CO·Filed 2015·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →