Inventor · disambiguated record
Johannes Lambertus Gerardus Maria Venrooij
Also filed as: VENROOIJ JOHANNES L G M · VENROOIJ JOHANNES LAMBERTUS GE · VENROOIJ JOHANNES LAMBERTUS GERARDUS MARIA · VENROOIJ JOHANNES LAMBERTUS GERARDUS MARLA
12 granted patents·2 pending applications·76 citations·filing 1990–2025
88Inventor score
Files withFICO BV6BESI NETHERLANDS BV5ASM FICO TOOLING1PETERS HENDRIKUS JOHANNES BERNARDUS1VENROOIJ JOHANNES LAMBERTUS GERARUS MARIA1
Top patents by PatentIndex Score
14 records- 0174US2025353226A1Method and Mould for Encapsulating Electronic Components Mounted on a CarrierBESI NETHERLANDS BV·Filed 2025·Application pending·0 cites
- 0265US7771184B2Press with plate-like frame parts, and method for operating such a plate pressFICO BV·Filed 2006·Granted Aug 10, 2010·2 cites·12 claims
- 0360US12420465B2Method and mould for encapsulating electronic components mounted on a carrierBESI NETHERLANDS BV·Filed 2021·Granted Sep 23, 2025·0 cites·6 claims
- 0459US8268217B2Method and device for encapsulating electronic components with a conditioning gasPETERS HENDRIKUS JOHANNES BERNARDUS·Filed 2005·Granted Sep 18, 2012·2 cites·11 claims
- 0558US8425826B2Method and device for controllable encapsulation of electronic componentsVENROOIJ JOHANNES LAMBERTUS GERARUS MARIA·Filed 2005·Granted Apr 23, 2013·1 cites·6 claims
- 0658US5297897ASingle-strip molding apparatusASM FICO TOOLING·Filed 1990·Granted Mar 29, 1994·37 cites·21 claims
- 0751US5656305ASystem for dosed conveying and selecting of cylindrical pellets for molding apparatus for lead framesFICO BV·Filed 1993·Granted Aug 12, 1997·16 cites·15 claims
- 0847US6848174B2Apparatus and method for processing electronic componentsFICO BV·Filed 2001·Granted Feb 1, 2005·3 cites·19 claims
- 0941US10913191B2Mould, moulding apparatus and method for controlled overmoulding of a carrier with electronic components and moulded productBESI NETHERLANDS BV·Filed 2015·Granted Feb 9, 2021·0 cites·7 claims
- 1041US2009115098A1Mould Part and Method for Encapsulating Electronic ComponentsFICO BV·Filed 2005·Application pending·0 cites
- 1140US11450550B2Handler device for handling substratesBESI NETHERLANDS BV·Filed 2019·Granted Sep 20, 2022·0 cites·20 claims
- 1240US6179599B1Sealing ejector pinFICO BV·Filed 1997·Granted Jan 30, 2001·10 cites·5 claims
- 1333US6165405APress for encapsulating electronic components and methods for use of the pressFICO BV·Filed 1997·Granted Dec 26, 2000·5 cites·8 claims
- 1431US10699924B2Modular system for moulding electronic components and kit-of-parts for assembling such a modular systemBESI NETHERLANDS BV·Filed 2016·Granted Jun 30, 2020·0 cites·17 claims
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →