Inventor · disambiguated record
Yueh-Chiung Chang
Also filed as: CHANG YUEH-CHIUNG
6 granted patents·2 pending applications·25 citations·filing 2000–2020
76Inventor score
Top patents by PatentIndex Score
8 records- 0178US8901729B2Semiconductor package, packaging substrate and fabrication method thereofCHEN CHIA-YIN·Filed 2012·Granted Dec 2, 2014·6 cites·12 claims
- 0265US10587041B2Electronic package structure and fabrication method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2017·Granted Mar 10, 2020·1 cites·27 claims
- 0364US6414379B1Structure of disturbing plate having down setSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2000·Granted Jul 2, 2002·17 cites·8 claims
- 0461US11476572B2Method for fabricating electronic package structureSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2020·Granted Oct 18, 2022·0 cites·23 claims
- 0560US10115712B2Electronic moduleSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2015·Granted Oct 30, 2018·1 cites·7 claims
- 0653US9269677B2Fabrication method of packaging substrateSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2014·Granted Feb 23, 2016·0 cites·9 claims
- 0734US2018047711A1Electronic stack structure having passive elements and method for fabricating the sameSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2016·Application pending·0 cites
- 0834US2004238923A1Surface-mount-enhanced lead frame and method for fabricating semiconductor package with the sameSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2004·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →