Inventor · disambiguated record
Andrew Seman
Also filed as: SEMAN ANDREW M · SEMAN ANDREW MICHAEL
16 granted patents·407 citations·filing 1990–2007
94Inventor score
Files withIBM16
Top patents by PatentIndex Score
16 records- 0198US6902869B2Manufacturing methods for printed circuit boardsIBM·Filed 2003·Granted Jun 7, 2005·156 cites·15 claims
- 0296US6222136B1Printed circuit board with continuous connective bumpsIBM·Filed 1997·Granted Apr 24, 2001·131 cites·13 claims
- 0386US7596862B2Method of making a circuitized substrateIBM·Filed 2007·Granted Oct 6, 2009·8 cites·12 claims
- 0477US6684497B2Manufacturing methods for printed circuit boardsIBM·Filed 2001·Granted Feb 3, 2004·16 cites·14 claims
- 0575US6586683B2Printed circuit board with mixed metallurgy pads and method of fabricationIBM·Filed 2001·Granted Jul 1, 2003·15 cites·15 claims
- 0671US5189261AElectrical and/or thermal interconnections and methods for obtaining suchIBM·Filed 1990·Granted Feb 23, 1993·52 cites·9 claims
- 0767US7240430B2Manufacturing methods for printed circuit boardsIBM·Filed 2005·Granted Jul 10, 2007·2 cites·7 claims
- 0860US6931722B2Method of fabricating printed circuit board with mixed metallurgy padsIBM·Filed 2003·Granted Aug 23, 2005·7 cites·19 claims
- 0955US7325299B2Method of making a circuitized substrateIBM·Filed 2007·Granted Feb 5, 2008·0 cites·15 claims
- 1049US6822332B2Fine line circuitizationIBM·Filed 2002·Granted Nov 23, 2004·1 cites·10 claims
- 1149US6429390B1Structure and method for forming the same of a printed wiring board having built-in inspection aidsIBM·Filed 2001·Granted Aug 6, 2002·5 cites·20 claims
- 1248US5920037AConductive bonding design for metal backed circuitsIBM·Filed 1997·Granted Jul 6, 1999·10 cites·5 claims
- 1345US7063756B2Enhanced design and process for a conductive adhesiveIBM·Filed 2003·Granted Jun 20, 2006·2 cites·17 claims
- 1444US7185428B2Method of making a circuitized substrateIBM·Filed 2003·Granted Mar 6, 2007·0 cites·21 claims
- 1532US6178630B1Conductive bonding design and method for aluminum backed circuitsIBM·Filed 1999·Granted Jan 30, 2001·2 cites·30 claims
- 1625US6534724B1Enhanced design and process for a conductive adhesiveIBM·Filed 1997·Granted Mar 18, 2003·0 cites·2 claims
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →