Inventor · disambiguated record
Jeffrey Mckeveny
Also filed as: MCKEVENY JEFFREY
15 granted patents·879 citations·filing 1990–2004
95Inventor score
Files withIBM15
Top patents by PatentIndex Score
15 records- 0198US6919514B2Structure having laser ablated features and method of fabricatingIBM·Filed 2003·Granted Jul 19, 2005·157 cites·12 claims
- 0298US6730857B2Structure having laser ablated features and method of fabricatingIBM·Filed 2001·Granted May 4, 2004·188 cites·9 claims
- 0396US5229550AEncapsulated circuitized power core alignment and laminationIBM·Filed 1992·Granted Jul 20, 1993·170 cites·7 claims
- 0495US5129142AEncapsulated circuitized power core alignment and laminationIBM·Filed 1990·Granted Jul 14, 1992·135 cites·14 claims
- 0583US5578796AApparatus for laminating and circuitizing substrates having openings thereinIBM·Filed 1995·Granted Nov 26, 1996·69 cites·10 claims
- 0680US7007378B2Process for manufacturing a printed wiring boardIBM·Filed 2002·Granted Mar 7, 2006·23 cites·5 claims
- 0775US6586683B2Printed circuit board with mixed metallurgy pads and method of fabricationIBM·Filed 2001·Granted Jul 1, 2003·15 cites·15 claims
- 0872US5599747AMethod of making circuitized substrateIBM·Filed 1995·Granted Feb 4, 1997·31 cites·15 claims
- 0966US5866237AOrganic electronic package and method of applying palladium-tin seed layer theretoIBM·Filed 1996·Granted Feb 2, 1999·27 cites·17 claims
- 1064US7070909B2UV absorbing glass cloth and use thereofIBM·Filed 2004·Granted Jul 4, 2006·9 cites·14 claims
- 1160US6931722B2Method of fabricating printed circuit board with mixed metallurgy padsIBM·Filed 2003·Granted Aug 23, 2005·7 cites·19 claims
- 1259US5542175AMethod of laminating and circuitizing substrates having openings thereinIBM·Filed 1994·Granted Aug 6, 1996·25 cites·10 claims
- 1352US6025057AOrganic electronic package and method of applying palladium-tin seed layer theretoIBM·Filed 1997·Granted Feb 15, 2000·15 cites·5 claims
- 1434US6838400B1UV absorbing glass cloth and use thereofIBM·Filed 1998·Granted Jan 4, 2005·4 cites·18 claims
- 1534US6485892B1Method for masking a hole in a substrate during platingIBM·Filed 1999·Granted Nov 26, 2002·4 cites·13 claims
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