Inventor · disambiguated record
Siva Prakash Gurrum
Also filed as: GURRUM SIVA P · GURRUM SIVA PRAKASH
28 granted patents·111 citations·filing 2007–2022
95Inventor score
Files withTEXAS INSTRUMENTS INC23LAMSON MICHAEL ANTHONY2EDWARDS DARVIN R1GURRUM SIVA P1GURRUM SIVA PRAKASH1
Top patents by PatentIndex Score
28 records- 0195US7956456B2Thermal interface material design for enhanced thermal performance and improved package structural integrityTEXAS INSTRUMENTS INC·Filed 2008·Granted Jun 7, 2011·37 cites·7 claims
- 0291US9165873B1Semiconductor package having etched foil capacitor integrated into leadframeTEXAS INSTRUMENTS INC·Filed 2014·Granted Oct 20, 2015·10 cites·14 claims
- 0390US7838988B1Stud bumps as local heat sinks during transient power operationsTEXAS INSTRUMENTS INC·Filed 2009·Granted Nov 23, 2010·18 cites·12 claims
- 0488US11387155B2IC having a metal ring thereon for stress reductionTEXAS INSTRUMENTS INC·Filed 2020·Granted Jul 12, 2022·2 cites·24 claims
- 0588US9030216B2Coaxial four-point probe for low resistance measurementsLAMSON MICHAEL ANTHONY·Filed 2012·Granted May 12, 2015·9 cites·10 claims
- 0685US11521904B2Wire bond damage detector including a detection bond pad over a first and a second connected structuresTEXAS INSTRUMENTS INC·Filed 2020·Granted Dec 6, 2022·2 cites·21 claims
- 0783US7989949B2Heat extraction from packaged semiconductor chips, scalable with chip areaTEXAS INSTRUMENTS INC·Filed 2009·Granted Aug 2, 2011·9 cites·18 claims
- 0880US8129224B2Stud bumps as local heat sinks during transient power operationsGURRUM SIVA P·Filed 2010·Granted Mar 6, 2012·7 cites·11 claims
- 0979US7572679B2Heat extraction from packaged semiconductor chips, scalable with chip areaTEXAS INSTRUMENTS INC·Filed 2007·Granted Aug 11, 2009·7 cites·16 claims
- 1078US9373572B2Semiconductor package having etched foil capacitor integrated into leadframeTEXAS INSTRUMENTS INC·Filed 2015·Granted Jun 21, 2016·2 cites·20 claims
- 1176US10622290B2Packaged multichip module with conductive connectorsTEXAS INSTRUMENTS INC·Filed 2018·Granted Apr 14, 2020·2 cites·19 claims
- 1276US10446414B2Semiconductor package with filler particles in a mold compoundTEXAS INSTRUMENTS INC·Filed 2017·Granted Oct 15, 2019·2 cites·19 claims
- 1372US11869820B2IC having a metal ring thereon for stress reductionTEXAS INSTRUMENTS INC·Filed 2022·Granted Jan 9, 2024·0 cites·21 claims
- 1471US12159808B2Wire bond damage detector including a detection bond pad over a first and a second connected structuresTEXAS INSTRUMENTS INC·Filed 2022·Granted Dec 3, 2024·0 cites·23 claims
- 1570US8716068B2Method for contacting agglomerate terminals of semiconductor packagesTEXAS INSTRUMENTS INC·Filed 2013·Granted May 6, 2014·2 cites·17 claims
- 1661US11538742B2Packaged multichip module with conductive connectorsTEXAS INSTRUMENTS INC·Filed 2020·Granted Dec 27, 2022·0 cites·18 claims
- 1761US8304897B2Thermal interface material design for enhanced thermal performance and improved package structural integrityGURRUM SIVA PRAKASH·Filed 2011·Granted Nov 6, 2012·1 cites·14 claims
- 1859US11139178B2Semiconductor package with filler particles in a mold compoundTEXAS INSTRUMENTS INC·Filed 2019·Granted Oct 5, 2021·0 cites·20 claims
- 1956US8643165B2Semiconductor device having agglomerate terminalsEDWARDS DARVIN R·Filed 2012·Granted Feb 4, 2014·1 cites·2 claims
- 2055US11121049B2Semiconductor package with a wire bond meshTEXAS INSTRUMENTS INC·Filed 2019·Granted Sep 14, 2021·0 cites·19 claims
- 2154US10204842B2Semiconductor package with a wire bond meshTEXAS INSTRUMENTS INC·Filed 2018·Granted Feb 12, 2019·0 cites·20 claims
- 2251US11430719B2Spot-solderable leads for semiconductor device packagesTEXAS INSTRUMENTS INC·Filed 2019·Granted Aug 30, 2022·0 cites·6 claims
- 2351US10607927B2Spot-solderable leads for semiconductor device packagesTEXAS INSTRUMENTS INC·Filed 2017·Granted Mar 31, 2020·0 cites·8 claims
- 2447US12412800B2Integrated circuit package having enhanced thermal dissipation structureTEXAS INSTRUMENTS INC·Filed 2021·Granted Sep 9, 2025·0 cites·19 claims
- 2547US9142496B1Semiconductor package having etched foil capacitor integrated into leadframeTEXAS INSTRUMENTS INC·Filed 2014·Granted Sep 22, 2015·0 cites·4 claims
- 2646US10497643B1Patterned die pad for packaged vertical semiconductor devicesTEXAS INSTRUMENTS INC·Filed 2018·Granted Dec 3, 2019·0 cites·19 claims
- 2744US8174276B2Coaxial four-point probe for low resistance measurementsLAMSON MICHAEL ANTHONY·Filed 2009·Granted May 8, 2012·0 cites·6 claims
- 2842US9157938B2On-time based peak current density rule and design methodTEXAS INSTRUMENTS INC·Filed 2012·Granted Oct 13, 2015·0 cites·3 claims
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