Inventor · disambiguated record
John Vannortwick
Also filed as: VANNORTWICK JOHN · VANNORTWICK JOHN E
36 granted patents·3 pending applications·362 citations·filing 1997–2009
98Inventor score
Top patents by PatentIndex Score
39 records- 0188US6440777B2Method of depositing a thermoplastic polymer in semiconductor fabricationMICRON TECHNOLOGY INC·Filed 2001·Granted Aug 27, 2002·32 cites·24 claims
- 0286US6329832B1Method for in-line testing of flip-chip semiconductor assembliesMICRON TECHNOLOGY INC·Filed 1998·Granted Dec 11, 2001·28 cites·14 claims
- 0379US6537400B1Automated method of attaching flip chip devices to a substrateMICRON TECHNOLOGY INC·Filed 2000·Granted Mar 25, 2003·20 cites·44 claims
- 0478US6238223B1Method of depositing a thermoplastic polymer in semiconductor fabricationMICRON TECHNOLOGY INC·Filed 1997·Granted May 29, 2001·34 cites·25 claims
- 0578US6012502AApparatus for attaching adhesive tape to lead-on-chip leadframesMICRON TECHNOLOGY INC·Filed 1997·Granted Jan 11, 2000·47 cites·11 claims
- 0675US9048272B2Devices and method for handling microelectronics assembliesFORSYTH VALORIS L·Filed 2009·Granted Jun 2, 2015·9 cites·13 claims
- 0772US6599365B1Apparatus for improving stencil/screen print qualityMICRON TECHNOLOGY INC·Filed 2000·Granted Jul 29, 2003·10 cites·15 claims
- 0871US6521287B2Method for manufacturing improved stencil/screenMICRON TECHNOLOGY INC·Filed 2000·Granted Feb 18, 2003·9 cites·29 claims
- 0970US6638831B1Use of a reference fiducial on a semiconductor package to monitor and control a singulation methodMICRON TECHNOLOGY INC·Filed 2000·Granted Oct 28, 2003·15 cites·11 claims
- 1070US6084311AMethod and apparatus for reducing resin bleed during the formation of a semiconductor deviceMICRON TECHNOLOGY INC·Filed 1997·Granted Jul 4, 2000·37 cites·17 claims
- 1169US6793749B2Automated method of attaching flip-chip devices to a substrateMICRON TECHNOLOGY INC·Filed 2003·Granted Sep 21, 2004·11 cites·12 claims
- 1267US6025212AMethod for attaching semiconductor dice to lead-on-chip leadframesMICRON TECHNOLOGY INC·Filed 1998·Granted Feb 15, 2000·29 cites·20 claims
- 1365US6607599B1Apparatus for improving stencil/screen print qualityMICRON TECHNOLOGY INC·Filed 2000·Granted Aug 19, 2003·6 cites·46 claims
- 1465US6368897B1Method for manufactoring and using stencil/screenMICRON TECHNOLOGY INC·Filed 2000·Granted Apr 9, 2002·6 cites·16 claims
- 1565US6281044B1Method and system for fabricating semiconductor componentsMICRON TECHNOLOGY INC·Filed 1999·Granted Aug 28, 2001·25 cites·20 claims
- 1664US6641669B1Method and apparatus for improving stencil/screen print qualityMICRON TECHNOLOGY INC·Filed 2000·Granted Nov 4, 2003·6 cites·24 claims
- 1763US6626222B1System for fabricating semiconductor componentsMICRON TECHNOLOGY INC·Filed 2000·Granted Sep 30, 2003·9 cites·15 claims
- 1862US7005878B2Method for in-line testing of flip-chip semiconductor assembliesMICRON TECHNOLOGY INC·Filed 2004·Granted Feb 28, 2006·3 cites·12 claims
- 1961US6953699B2Method for in-line testing of flip-chip semiconductor assembliesMICRON TECHNOLOGY INC·Filed 2004·Granted Oct 11, 2005·3 cites·8 claims
- 2061US6545498B2Method for in-line testing of flip-chip semiconductor assembliesMICRON TECHNOLOGY INC·Filed 2001·Granted Apr 8, 2003·3 cites·4 claims
- 2159US7105366B2Method for in-line testing of flip-chip semiconductor assembliesMICRON TECHNOLOGY INC·Filed 2003·Granted Sep 12, 2006·3 cites·8 claims
- 2256US6773523B2Automated method of attaching flip chip devices to a substrateMICRON TECHNOLOGY INC·Filed 2001·Granted Aug 10, 2004·5 cites·33 claims
- 2356US6472901B2Method for in-line testing of flip-chip semiconductor assembliesMICRON TECHNOLOGY INC·Filed 2001·Granted Oct 29, 2002·2 cites·7 claims
- 2456US6369602B1Method for in-line testing of flip-chip semiconductor assembliesMICRON TECHNOLOGY INC·Filed 2000·Granted Apr 9, 2002·2 cites·8 claims
- 2554US6972200B2Method for manufacturing flip-chip semiconductor assemblyMICRON TECHNOLOGY INC·Filed 2003·Granted Dec 6, 2005·2 cites·7 claims
- 2653US6744134B2Use of a reference fiducial on a semiconductor package to monitor and control a singulation methodMICRON TECHNOLOGY INC·Filed 2002·Granted Jun 1, 2004·5 cites·25 claims
- 2751US7074648B2Method for packaging flip-chip semiconductor assembliesMICRON TECHNOLOGY INC·Filed 2003·Granted Jul 11, 2006·1 cites·6 claims
- 2846US6962826B2Method for in-line testing of flip-chip semiconductor assembliesMICRON TECHNOLOGY INC·Filed 2004·Granted Nov 8, 2005·0 cites·9 claims
- 2946US6953700B2Method for in-line testing of flip-chip semiconductor assembliesMICRON TECHNOLOGY INC·Filed 2004·Granted Oct 11, 2005·0 cites·5 claims
- 3045US6967113B2Method for in-line testing of flip-chip semiconductor assembliesMICRON TECHNOLOGY INC·Filed 2003·Granted Nov 22, 2005·0 cites·8 claims
- 3143US7476277B2Apparatus for improving stencil/screen print qualityMICRON TECHNOLOGY INC·Filed 2003·Granted Jan 13, 2009·0 cites·20 claims
- 3243US6982177B2Method for in-line testing of flip-chip semiconductor assembliesMICRON TECHNOLOGY INC·Filed 2004·Granted Jan 3, 2006·0 cites·6 claims
- 3343US2004107902A1Stencil/screen print apparatusMICRON TECHNOLOGY INC·Filed 2003·Application pending·0 cites
- 3442US6949943B2Method for in-line testing of flip-chip semiconductor assembliesMICRON TECHNOLOGY INC·Filed 2004·Granted Sep 27, 2005·0 cites·6 claims
- 3542US2005145169A1Apparatus for improving stencil/screen print qualityMICRON TECHNOLOGY INC·Filed 2003·Application pending·0 cites
- 3641US6954081B2Method for in-line testing of flip-chip semiconductor assembliesMICRON TECHNOLOGY INC·Filed 2003·Granted Oct 11, 2005·0 cites·6 claims
- 3740US6750070B2Process for manufacturing flip-chip semiconductor assemblyMICRON TECHNOLOGY INC·Filed 2002·Granted Jun 15, 2004·0 cites·6 claims
- 3840US2010089851A1Devices and methods for handling microelectronic assembliesMICRON TECHNOLOGY INC·Filed 2008·Application pending·0 cites
- 3931US6669781B2Method and apparatus for improving stencil/screen print qualityMICRON TECHNOLOGY INC·Filed 1997·Granted Dec 30, 2003·0 cites·77 claims
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →