Inventor

KAWAKITA JIN

JP12 patents

⚠️ This page may combine multiple inventors who share the name “KAWAKITA JIN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

NAT INST MATERIALS SCIENCE

6 patents

US11486843B2Nov 1, 2022

Dryness/wetness responsive sensor

NAT INST MATERIALS SCIENCE2 citations69

US11454603B2Sep 27, 2022

Dew point measuring method and dew point measuring device

NAT INST MATERIALS SCIENCE0 citations60

US11856664B2Dec 26, 2023

Method and system for preventing dew condensation and light scattering due to dew condensation

NAT INST MATERIALS SCIENCE0 citations49

US11913892B2Feb 27, 2024

Condensation detection element

NAT INST MATERIALS SCIENCE0 citations48

US10267756B2Apr 23, 2019

Dryness/wetness responsive sensor having first and second wires spaced 5 nm to less than 20 μm apart

NAT INST MATERIALS SCIENCE0 citations48

US10830573B2Nov 10, 2020

Droplet size determining device and droplet size determining method

NAT INST MATERIALS SCIENCE0 citations39

KAWAKITA JIN

4 patents

US8802192B2Aug 12, 2014

Warm spray coating method and particles used therefor

KAWAKITA JIN0 citations48

US10043598B2Aug 7, 2018

Process for precipitation of conducting polymer/metal composites, and conducting polymer/metal composites

KAWAKITA JIN0 citations47

US8563975B2Oct 22, 2013

Hetero pn junction semiconductor and process for producing the same

KAWAKITA JIN0 citations46

US8637121B2Jan 28, 2014

Resin coated member and method of resin coating

KAWAKITA JIN0 citations38

NAT INST FOR MATERIALS SCIENCE

2 patents

US9703197B2Jul 11, 2017

High-sensitivity multilayer resist film and method of increasing photosensitivity of resist film

NAT INST FOR MATERIALS SCIENCE0 citations48

US9622346B2Apr 11, 2017

Adhesive body comprising conductive polymer-metal complex and substrate and method for forming the same, conductive polymer-metal complex dispersion liquid, method for manufacturing the same and method for applying the same, and method for filling hole using conductive material

NAT INST FOR MATERIALS SCIENCE0 citations48