Inventor · disambiguated record
John Dungan
Also filed as: DUNGAN JOHN · DUNGAN JOHN H
12 granted patents·3 pending applications·354 citations·filing 2001–2007
92Inventor score
Files withINTEL CORP12
Top patents by PatentIndex Score
15 records- 0197US6787443B1PCB design and method for providing vented blind viasINTEL CORP·Filed 2003·Granted Sep 7, 2004·139 cites·6 claims
- 0292US6580174B2Vented vias for via in pad technology yield improvementsINTEL CORP·Filed 2001·Granted Jun 17, 2003·84 cites·13 claims
- 0383US7583513B2Apparatus for providing an integrated printed circuit board registration couponINTEL CORP·Filed 2003·Granted Sep 1, 2009·31 cites·11 claims
- 0483US6941537B2Standoff devices and methods of using sameINTEL CORP·Filed 2002·Granted Sep 6, 2005·31 cites·63 claims
- 0578US7325303B2Three-dimensional flexible interposerINTEL CORP·Filed 2006·Granted Feb 5, 2008·15 cites·19 claims
- 0673US7385288B2Electronic packaging using conductive interproser connectorINTEL CORP·Filed 2007·Granted Jun 10, 2008·5 cites·8 claims
- 0769US7084354B2PCB method and apparatus for producing landless interconnectsINTEL CORP·Filed 2002·Granted Aug 1, 2006·14 cites·26 claims
- 0867US7201583B2Three-dimensional flexible interposerINTEL CORP·Filed 2003·Granted Apr 10, 2007·14 cites·19 claims
- 0958US6667090B2Coupon registration mechanism and methodINTEL CORP·Filed 2001·Granted Dec 23, 2003·7 cites·26 claims
- 1055US7061116B2Arrangement of vias in a substrate to support a ball grid arrayINTEL CORP·Filed 2001·Granted Jun 13, 2006·6 cites·3 claims
- 1151US7241680B2Electronic packaging using conductive interposer connectorINTEL CORP·Filed 2004·Granted Jul 10, 2007·4 cites·7 claims
- 1249US7147141B2Preconditioning via plug material for a via-in-pad ball grid array packageINTEL CORP·Filed 2002·Granted Dec 12, 2006·4 cites·17 claims
- 1343US2004231886A1PCB design and method for providing vented blind viasFiled 2004·Application pending·0 cites
- 1439US2004219342A1Electronic substrate with direct inner layer component interconnectionFiled 2003·Application pending·0 cites
- 1536US2004129453A1Electronic substrate with direct inner layer component interconnectionFiled 2003·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →