Inventor · disambiguated record
Keiji Shinohara
Also filed as: SHINOHARA KEIJI
11 granted patents·1 pending application·160 citations·filing 1991–2014
91Inventor score
Top patents by PatentIndex Score
12 records- 0161US5194118ADry etching methodSONY CORP·Filed 1991·Granted Mar 16, 1993·33 cites·6 claims
- 0257US5591302AProcess for etching copper containing metallic film and for forming copper containing metallic wiringSONY CORP·Filed 1995·Granted Jan 7, 1997·17 cites·3 claims
- 0355US5207868AEtching process for films of aluminum or its alloysSONY CORP·Filed 1991·Granted May 4, 1993·26 cites·10 claims
- 0454US5914277AMethod for forming metallic wiring patternSONY CORP·Filed 1997·Granted Jun 22, 1999·19 cites·10 claims
- 0548US5200032ADry etching methodSONY CORP·Filed 1991·Granted Apr 6, 1993·15 cites·3 claims
- 0647US5505322AProcess for etching copper containing metallic film and forming copper containing metallic wiringSONY CORP·Filed 1995·Granted Apr 9, 1996·10 cites·4 claims
- 0747US5502334AMetal wiringSONY CORP·Filed 1993·Granted Mar 26, 1996·16 cites·16 claims
- 0843US2015161295A1Cae analysis method and cae analysis apparatusTOYOTA MOTOR CO LTD·Filed 2014·Application pending·0 cites
- 0942US6355553B1Method of forming a metal plug in a contact holeSONY CORP·Filed 1993·Granted Mar 12, 2002·13 cites·9 claims
- 1042US5569627AProcess for etching copper containing metallic film and for forming copper containing metallic wiringSONY CORP·Filed 1995·Granted Oct 29, 1996·7 cites·3 claims
- 1131US5312515ADry etching methodSONY CORP·Filed 1992·Granted May 17, 1994·3 cites·2 claims
- 1230US5288952AMultilayer connectorSONY CORP·Filed 1991·Granted Feb 22, 1994·1 cites·5 claims
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