Inventor · disambiguated record
Sven Evers
Also filed as: EVERS SVEN
25 granted patents·308 citations·filing 1996–2003
97Inventor score
Top patents by PatentIndex Score
25 records- 0193US6709967B2Laser wire bonding for wire embedded dielectrics to integrated circuitsMICRON TECHNOLOGY INC·Filed 2002·Granted Mar 23, 2004·49 cites·62 claims
- 0280US5810926AMethod and apparatus for applying atomized adhesive to a leadframe for chip bondingMICRON TECHNOLOGY INC·Filed 1996·Granted Sep 22, 1998·42 cites·29 claims
- 0373US5962862AMethod and apparatus for verifying the presence or absence of a componentMICRON TECHNOLOGY INC·Filed 1997·Granted Oct 5, 1999·43 cites·21 claims
- 0465US6390853B2Laser wire bonding for wire embedded dielectrics to integrated circuitsMICRON TECHNOLOGY INC·Filed 2001·Granted May 21, 2002·7 cites·44 claims
- 0562US6352191B1Non-conductive and self-leveling leadframe clamp insert for wirebonding integrated circuitsMICRON TECHNOLOGY INC·Filed 2000·Granted Mar 5, 2002·6 cites·29 claims
- 0661US5874322AMethod and apparatus for applying atomized adhesive to a leadframe for chip bondingMICRON TECHNOLOGY INC·Filed 1997·Granted Feb 23, 1999·18 cites·2 claims
- 0760US6588649B2Non-conductive and self-leveling leadframe clamp insert for wirebonding integrated circuitsMICRON TECHNOLOGY INC·Filed 2002·Granted Jul 8, 2003·5 cites·13 claims
- 0860US6375061B1Non-conductive and self-leveling leadframe clamp insert for wirebonding integrated circuitsMICRON TECHNOLOGY INC·Filed 2000·Granted Apr 23, 2002·5 cites·13 claims
- 0960US6105846ANon-conductive and self-leveling leadframe clamp insert for wirebonding integrated circuitsMICRON TECHNOLOGY INC·Filed 1999·Granted Aug 22, 2000·15 cites·12 claims
- 1060US5956607ALaser wire bonding for wire embedded dielectrics to integrated circuitsMICRON TECHNOLOGY INC·Filed 1997·Granted Sep 21, 1999·14 cites·44 claims
- 1158US5731244ALaser wire bonding for wire embedded dielectrics to integrated circuitsMICRON TECHNOLOGY INC·Filed 1996·Granted Mar 24, 1998·14 cites·77 claims
- 1257US6817823B2Method, device and system for semiconductor wafer transferMARIAN CORP·Filed 2002·Granted Nov 16, 2004·12 cites·16 claims
- 1355US6159609AMethod and apparatus for applying atomized adhesive to a leadframe for chip bondingMICRON TECHNOLOGY INC·Filed 1999·Granted Dec 12, 2000·13 cites·26 claims
- 1454US6921017B2Non-conductive and self-leveling leadframe clamp insert for wirebonding integrated circuitsMICRON TECHNOLOGY INC·Filed 2003·Granted Jul 26, 2005·3 cites·31 claims
- 1552US6138891ANon-conductive and self-leveling leadframe clamp insert for wirebonding integrated circuitsMICRON TECHNOLOGY INC·Filed 1999·Granted Oct 31, 2000·10 cites·29 claims
- 1651US6634538B2Non-conductive and self-leveling leadframe clamp insert for wirebonding integrated circuitsMICRON TECHNOLOGY INC·Filed 2001·Granted Oct 21, 2003·4 cites·29 claims
- 1751US5836454ALead frame casingMICRON TECHNOLOGY INC·Filed 1996·Granted Nov 17, 1998·14 cites·19 claims
- 1850US6126062ANon-conductive and self-leveling leadframe clamp insert for wirebonding integrated circuitsMICRON TECHNOLOGY INC·Filed 1998·Granted Oct 3, 2000·9 cites·13 claims
- 1942US6030711AMethod and apparatus for applying atomized adhesive to a leadframe for chip bondingMICRON TECHNOLOGY INC·Filed 1998·Granted Feb 29, 2000·6 cites·15 claims
- 2041US5996805ALead frame casingMICRON TECHNOLOGY INC·Filed 1997·Granted Dec 7, 1999·7 cites·13 claims
- 2139US5872405ALaser wire bonding for wire embedded dielectrics to integrated circuitsMICRON TECHNOLOGY INC·Filed 1997·Granted Feb 16, 1999·4 cites·3 claims
- 2237US6001725ALaser wire bonding for wire embedded dielectrics to integrated circuitsMICRON TECHNOLOGY INC·Filed 1997·Granted Dec 14, 1999·3 cites·77 claims
- 2336US6129039AApparatus for applying atomized adhesive to a leadframe for chip bondingMICRON TECHNOLOGY INC·Filed 1999·Granted Oct 10, 2000·4 cites·19 claims
- 2431US6211053B1Laser wire bonding for wire embedded dielectrics to integrated circuitsMICRON TECHNOLOGY INC·Filed 1999·Granted Apr 3, 2001·0 cites·44 claims
- 2531US6132798AMethod for applying atomized adhesive to a leadframe for chip bondingMICRON TECHNOLOGY INC·Filed 1998·Granted Oct 17, 2000·1 cites·32 claims
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