Inventor · disambiguated record
Chung-Long Chang
Also filed as: CHANG CHUNG L · CHANG CHUNG-LONG
60 granted patents·4 pending applications·1,264 citations·filing 1996–2023
99Inventor score
Files withTAIWAN SEMICONDUCTOR MFG43TAIWAN SEMICONDUCTOR MFG CO LTD16CHANG CHUNG-LONG3CHEN YUEH-YOU1HUA WEI-CHUN1
Top patents by PatentIndex Score
64 records- 0197US6010962ACopper chemical-mechanical-polishing (CMP) dishingTAIWAN SEMICONDUCTOR MFG·Filed 1999·Granted Jan 4, 2000·339 cites·47 claims
- 0296US6136680AMethods to improve copper-fluorinated silica glass interconnectsTAIWAN SEMICONDUCTOR MFG·Filed 2000·Granted Oct 24, 2000·133 cites·35 claims
- 0395US10475877B1Multi-terminal inductor for integrated circuitTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Nov 12, 2019·6 cites·20 claims
- 0489US9269591B2Handle wafer for high resistivity trap-rich SOITAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted Feb 23, 2016·10 cites·16 claims
- 0589US7760144B2Antennas integrated in semiconductor chipsTAIWAN SEMICONDUCTOR MFG·Filed 2008·Granted Jul 20, 2010·17 cites·22 claims
- 0688US10269701B2Semiconductor structure with ultra thick metal and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Apr 23, 2019·4 cites·17 claims
- 0787US7335956B2Capacitor device with vertically arranged capacitor regions of various kindsTAIWAN SEMICONDUCTOR MFG·Filed 2005·Granted Feb 26, 2008·18 cites·22 claims
- 0887US5786260AMethod of fabricating a readable alignment mark structure using enhanced chemical mechanical polishingTAIWAN SEMICONDUCTOR MFG·Filed 1996·Granted Jul 28, 1998·80 cites·22 claims
- 0986US8022458B2Capacitors integrated with metal gate formationTAIWAN SEMICONDUCTOR MFG·Filed 2007·Granted Sep 20, 2011·12 cites·14 claims
- 1085US6888063B1Device and method for providing shielding in radio frequency integrated circuits to reduce noise couplingTAIWAN SEMICONDUCTOR MFG·Filed 2004·Granted May 3, 2005·42 cites·29 claims
- 1184US8765600B2Contact structure for reducing gate resistance and method of making the sameCHANG CHUNG-LONG·Filed 2010·Granted Jul 1, 2014·10 cites·20 claims
- 1284US7545022B2Capacitor pairs with improved mismatch performanceTAIWAN SEMICONDUCTOR MFG·Filed 2006·Granted Jun 9, 2009·11 cites·5 claims
- 1382US8237209B2Capacitors integrated with metal gate formationCHANG CHUNG-LONG·Filed 2011·Granted Aug 7, 2012·6 cites·20 claims
- 1482US8053865B2MOM capacitors integrated with air-gapsTAIWAN SEMICONDUCTOR MFG·Filed 2008·Granted Nov 8, 2011·10 cites·15 claims
- 1582US6465294B1Self-aligned process for a stacked gate RF MOSFET deviceTAIWAN SEMICONDUCTOR MFG·Filed 2001·Granted Oct 15, 2002·31 cites·17 claims
- 1681US8330251B2Semiconductor device structure for reducing mismatch effectsCHANG CHUNG-LONG·Filed 2006·Granted Dec 11, 2012·11 cites·18 claims
- 1779US8169014B2Interdigitated capacitive structure for an integrated circuitCHEN YUEH-YOU·Filed 2006·Granted May 1, 2012·14 cites·14 claims
- 1879US6949781B2Metal-over-metal devices and the method for manufacturing sameTAIWAN SEMICONDUCTOR MFG·Filed 2003·Granted Sep 27, 2005·26 cites·19 claims
- 1979US6049137AReadable alignment mark structure formed using enhanced chemical mechanical polishingTAIWAN SEMICONDUCTOR MFG·Filed 1998·Granted Apr 11, 2000·47 cites·11 claims
- 2079US5933744AAlignment method for used in chemical mechanical polishing processTAIWAN SEMICONDUCTOR MFG·Filed 1998·Granted Aug 3, 1999·53 cites·20 claims
- 2177US6410424B1Process flow to optimize profile of ultra small size photo resist free contactTAIWAN SEMICONDUCTOR MFG·Filed 2001·Granted Jun 25, 2002·26 cites·26 claims
- 2276US6153512AProcess to improve adhesion of HSQ to underlying materialsTAIWAN SEMICONDUCTOR MFG·Filed 1999·Granted Nov 28, 2000·47 cites·17 claims
- 2375US7923817B2Capacitor pairs with improved mismatch performanceTAIWAN SEMICONDUCTOR MFG·Filed 2009·Granted Apr 12, 2011·5 cites·10 claims
- 2475US7050290B2Integrated capacitorTAIWAN SEMICONDUCTOR MFG·Filed 2004·Granted May 23, 2006·21 cites·21 claims
- 2574US10672860B2Multi-terminal inductor for integrated circuitTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Jun 2, 2020·1 cites·20 claims
- 2674US6613623B1High fMAX deep submicron MOSFETTAIWAN SEMICONDUCTOR MFG·Filed 2001·Granted Sep 2, 2003·18 cites·45 claims
- 2774US6391792B1Multi-step chemical mechanical polish (CMP) planarizing method for forming patterned planarized aperture fill layerTAIWAN SEMICONDUCTOR MFG·Filed 2000·Granted May 21, 2002·22 cites·18 claims
- 2874US6350693B2Method of CMP of polysiliconTAIWAN SEMICONDUCTOR MFG·Filed 2001·Granted Feb 26, 2002·14 cites·8 claims
- 2973US11670584B2Semiconductor structure with ultra thick metal and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Jun 6, 2023·0 cites·20 claims
- 3073US10515949B2Integrated circuit and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2013·Granted Dec 24, 2019·3 cites·20 claims
- 3171US11264378B2Integrated circuitTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Mar 1, 2022·1 cites·20 claims
- 3269US6559040B1Process for polishing the top surface of a polysilicon gateTAIWAN SEMICONDUCTOR MFG·Filed 1999·Granted May 6, 2003·28 cites·13 claims
- 3369US6207483B1Method for smoothing polysilicon gate structures in CMOS devicesTAIWAN SEMICONDUCTOR MFG·Filed 2000·Granted Mar 27, 2001·12 cites·3 claims
- 3467US10879342B2Multi-terminal inductor for integrated circuitTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Dec 29, 2020·0 cites·20 claims
- 3565US6737310B2Self-aligned process for a stacked gate RF MOSFET deviceTAIWAN SEMICONDUCTOR MFG·Filed 2002·Granted May 18, 2004·11 cites·14 claims
- 3664US11114378B2Semiconductor structure with ultra thick metal and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Sep 7, 2021·0 cites·20 claims
- 3763US7035083B2Interdigitated capacitor and method for fabrication thereofTAIWAN SEMICONDUCTOR MFG·Filed 2004·Granted Apr 25, 2006·10 cites·16 claims
- 3862US8941211B2Integrated circuit using deep trench through silicon (DTS)TAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Jan 27, 2015·1 cites·20 claims
- 3962US7612984B2Layout for capacitor pair with high capacitance matchingTAIWAN SEMICONDUCTOR MFG·Filed 2006·Granted Nov 3, 2009·2 cites·19 claims
- 4062US5709755AMethod for CMP cleaning improvementTAIWAN SEMICONDUCTOR MFG·Filed 1996·Granted Jan 20, 1998·27 cites·15 claims
- 4159US2025105142A1Radio frequency inductorTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 4259US2025169085A1Semiconductor devices including circuits under inductor (cul)TAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 4357US2024355728A1Semiconductor structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 4455US8971014B2Protection structure for metal-oxide-metal capacitorHUA WEI-CHUN·Filed 2011·Granted Mar 3, 2015·1 cites·20 claims
- 4555US6746966B1Method to solve alignment mark blinded issues and a technology for application of semiconductor etching at a tiny areaTAIWAN SEMICONDUCTOR MFG·Filed 2003·Granted Jun 8, 2004·4 cites·40 claims
- 4655US6200875B1Chemical mechanical polishing of polysilicon plug using a silicon nitride stop layerTAIWAN SEMICONDUCTOR MFG·Filed 1998·Granted Mar 13, 2001·17 cites·13 claims
- 4753US9230988B2Mechanisms for forming radio frequency (RF) area of integrated circuit structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2013·Granted Jan 5, 2016·0 cites·20 claims
- 4853US6268281B1Method to form self-aligned contacts with polysilicon plugsTAIWAN SEMICONDUCTOR MFG·Filed 1999·Granted Jul 31, 2001·18 cites·17 claims
- 4953US6242356B1Etchback method for forming microelectronic layer with enhanced surface smoothnessTAIWAN SEMICONDUCTOR MFG·Filed 1999·Granted Jun 5, 2001·17 cites·38 claims
- 5053US5972798APrevention of die loss to chemical mechanical polishingTAIWAN SEMICONDUCTOR MFG·Filed 1998·Granted Oct 26, 1999·16 cites·6 claims
Showing the top 50 of 64 patent records by PatentIndex Score.
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