Inventor · disambiguated record
Takekazu Sakai
Also filed as: SAKAI TAKEKAZU
14 granted patents·5 pending applications·160 citations·filing 1994–2014
92Inventor score
Top patents by PatentIndex Score
19 records- 0177US5556023AMethod of forming solder filmSHOWA DENKO KK·Filed 1994·Granted Sep 17, 1996·40 cites·7 claims
- 0275US9078382B2Method of producing circuit boardSHOJI TAKASHI·Filed 2010·Granted Jul 7, 2015·3 cites·20 claims
- 0373US5982629ASilicon semiconductor device,electrode structure therefor, and circuit board mounted therewithSHOWA DENKO KK·Filed 1998·Granted Nov 9, 1999·37 cites·18 claims
- 0470US7775417B2Method of producing conductive circuit boardSHOWDA DENKO K K·Filed 2007·Granted Aug 17, 2010·4 cites·14 claims
- 0569US6476487B2Solder circuitSHOWA DENKO KK·Filed 2001·Granted Nov 5, 2002·16 cites·20 claims
- 0665US8661659B2Method of producing circuit boardSHOJI TAKASHI·Filed 2010·Granted Mar 4, 2014·1 cites·5 claims
- 0764US8752754B2Apparatus for adhering solder powder and method for adhering solder powder to electronic circuit boardSHOJI TAKASHI·Filed 2011·Granted Jun 17, 2014·1 cites·10 claims
- 0857US5713997ASolution for selectively imparting tackiness to a metallic surfaceSHOWA DENKO KK·Filed 1995·Granted Feb 3, 1998·16 cites·1 claims
- 0955US5928440AMethod of forming solder filmSHOWA DENKO KK·Filed 1995·Granted Jul 27, 1999·14 cites·2 claims
- 1053US5750271AMethod of forming solder filmSHOWA DENKO KK·Filed 1995·Granted May 12, 1998·13 cites·3 claims
- 1152US6221692B1Method of fabricating solder-bearing silicon semiconductor device and circuit board mounted therewithSHOWA DENKO KK·Filed 1999·Granted Apr 24, 2001·15 cites·10 claims
- 1249US8109432B2Method for attachment of solder powder to electronic circuit board and solder-attached electronic circuit boardSHOJI TAKASHI·Filed 2008·Granted Feb 7, 2012·0 cites·8 claims
- 1348US2010009070A1Method for forming solder layer on printed-wiring board and slurry discharge deviceSHOWA DENKO KK·Filed 2007·Application pending·0 cites
- 1448US2010038411A1Method of producing conductive circuit boardSHOWA DENKO KK·Filed 2007·Application pending·0 cites
- 1547US8038051B2Method for production of electronic circuit boardSHOWA DENKO KK·Filed 2005·Granted Oct 18, 2011·0 cites·10 claims
- 1646US8123111B2Production method of solder circuit boardSHOJI TAKASHI·Filed 2006·Granted Feb 28, 2012·0 cites·7 claims
- 1746US2009041990A1Method for attachment of solder powder to electronic circuit board and soldered electronic circuit boardSHOWA DENKO KK·Filed 2006·Application pending·0 cites
- 1844US2016219721A1Method for manufacturing solder circuit board, solder circuit board, and method for mounting electronic componentSHOWA DENKO KK·Filed 2014·Application pending·0 cites
- 1944US2009261148A1Production method of solder circuit boardSHOWA DENKO KK·Filed 2007·Application pending·0 cites
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