Inventor · disambiguated record
Masataka Watabe
Also filed as: WATABE MASATAKA
15 granted patents·126 citations·filing 1994–2021
92Inventor score
Top patents by PatentIndex Score
15 records- 0189US10395830B2Multi-layer ceramic electronic componentTAIYO YUDEN KK·Filed 2018·Granted Aug 27, 2019·4 cites·4 claims
- 0288US10354801B2Multi-layer ceramic electronic componentTAIYO YUDEN KK·Filed 2018·Granted Jul 16, 2019·4 cites·4 claims
- 0388US9502181B2Low-height multilayer ceramic capacitorTAIYO YUDEN KK·Filed 2014·Granted Nov 22, 2016·7 cites·4 claims
- 0483US11017952B2Multi-layer ceramic electronic componentTAIYO YUDEN KK·Filed 2019·Granted May 25, 2021·2 cites·7 claims
- 0580US8564930B2Laminated capacitorHOSHI YUJI·Filed 2012·Granted Oct 22, 2013·4 cites·15 claims
- 0678US8958213B2Mounting structure of chip componentTAIYO YUDEN KK·Filed 2013·Granted Feb 17, 2015·4 cites·9 claims
- 0777US5556023AMethod of forming solder filmSHOWA DENKO KK·Filed 1994·Granted Sep 17, 1996·40 cites·7 claims
- 0873US10319658B2Electronic component package and method of housing an electronic componentTAIYO YUDEN KK·Filed 2018·Granted Jun 11, 2019·2 cites·6 claims
- 0969US6476487B2Solder circuitSHOWA DENKO KK·Filed 2001·Granted Nov 5, 2002·16 cites·20 claims
- 1066US11557439B2Multi-layer ceramic electronic componentTAIYO YUDEN KK·Filed 2021·Granted Jan 17, 2023·0 cites·7 claims
- 1159US8810993B2Laminated capacitorTAIYO YUDEN KK·Filed 2013·Granted Aug 19, 2014·0 cites·5 claims
- 1257US5713997ASolution for selectively imparting tackiness to a metallic surfaceSHOWA DENKO KK·Filed 1995·Granted Feb 3, 1998·16 cites·1 claims
- 1355US5928440AMethod of forming solder filmSHOWA DENKO KK·Filed 1995·Granted Jul 27, 1999·14 cites·2 claims
- 1453US5750271AMethod of forming solder filmSHOWA DENKO KK·Filed 1995·Granted May 12, 1998·13 cites·3 claims
- 1547US11024461B2Multi-layer ceramic electronic component having external electrode with base film and electrically conductive thin filmTAIYO YUDEN KK·Filed 2019·Granted Jun 1, 2021·0 cites·4 claims
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