Inventor · disambiguated record
Chiaki Takubo
Also filed as: TAKUBO CHIAKI
63 granted patents·15 pending applications·1,862 citations·filing 1988–2017
99Inventor score
Files withTOSHIBA KK55TANIDA KAZUMASA4SHINKO ELECTRIC IND CO3NUMATA HIDEO2SUMITOMO ELECTRIC INDUSTRIES2
Top patents by PatentIndex Score
78 records- 0195US6329610B1Hybrid wiring board, semiconductor apparatus, flexible substrate, and fabrication method of hybrid wiring boardTOSHIBA KK·Filed 1998·Granted Dec 11, 2001·225 cites·37 claims
- 0294US6717251B2Stacked type semiconductor deviceTOSHIBA KK·Filed 2001·Granted Apr 6, 2004·103 cites·26 claims
- 0394US5394010ASemiconductor assembly having laminated semiconductor devicesTOSHIBA KK·Filed 1992·Granted Feb 28, 1995·182 cites·13 claims
- 0493US6111317AFlip-chip connection type semiconductor integrated circuit deviceTOSHIBA KK·Filed 1997·Granted Aug 29, 2000·157 cites·16 claims
- 0590US9852995B1Semiconductor deviceTOSHIBA KK·Filed 2017·Granted Dec 26, 2017·6 cites·20 claims
- 0689US5801447AFlip chip mounting type semiconductor deviceTOSHIBA KK·Filed 1996·Granted Sep 1, 1998·107 cites·5 claims
- 0789US5631499ASemiconductor device comprising fine bump electrode having small side etch portion and stable characteristicsTOSHIBA KK·Filed 1996·Granted May 20, 1997·118 cites·12 claims
- 0888US5712493ADisplay device having driving circuits at the periphery of a substrateTOSHIBA KK·Filed 1996·Granted Jan 27, 1998·103 cites·19 claims
- 0985US5773888ASemiconductor device having a bump electrode connected to an inner leadTOSHIBA KK·Filed 1995·Granted Jun 30, 1998·84 cites·7 claims
- 1083US8338904B2Semiconductor device and method for manufacturing the sameTANIDA KAZUMASA·Filed 2010·Granted Dec 25, 2012·3 cites·11 claims
- 1181US7202563B2Semiconductor device package having a semiconductor element with resinTOSHIBA KK·Filed 2005·Granted Apr 10, 2007·7 cites·12 claims
- 1281US5747881ASemiconductor device, method of fabricating the same and copper leadsTOSHIBA KK·Filed 1996·Granted May 5, 1998·54 cites·28 claims
- 1380US6376907B1Ball grid array type package for semiconductor deviceTOSHIBA KK·Filed 1998·Granted Apr 23, 2002·60 cites·26 claims
- 1480US5825081ATape carrier and assembly structure thereofTOSHIBA KK·Filed 1996·Granted Oct 20, 1998·60 cites·18 claims
- 1579US4991001AIC packing device with impedance adjusting insulative layerTOSHIBA KK·Filed 1989·Granted Feb 5, 1991·53 cites·16 claims
- 1677US7932605B2Semiconductor device and manufacturing method thereforTOSHIBA KK·Filed 2007·Granted Apr 26, 2011·6 cites·13 claims
- 1774US7095112B2Semiconductor device, semiconductor package member, and semiconductor device manufacturing methodTOSHIBA KK·Filed 2003·Granted Aug 22, 2006·20 cites·15 claims
- 1873US7531876B2Semiconductor device having power semiconductor elementsTOSHIBA KK·Filed 2005·Granted May 12, 2009·6 cites·14 claims
- 1973US7364369B2Lead frame, optical coupling part using lead frame, and manufacturing method of optical coupling partSUMITOMO ELECTRIC INDUSTRIES·Filed 2007·Granted Apr 29, 2008·5 cites·6 claims
- 2073US7352052B2Semiconductor device and manufacturing method thereforTOSHIBA KK·Filed 2004·Granted Apr 1, 2008·16 cites·4 claims
- 2172US8426977B2Semiconductor apparatus, manufacturing method of semiconductor apparatus, and camera moduleTANIDA KAZUMASA·Filed 2009·Granted Apr 23, 2013·5 cites·12 claims
- 2272US7888760B2Solid state imaging device and method for manufacturing same, and solid state imaging moduleTOSHIBA KK·Filed 2008·Granted Feb 15, 2011·5 cites·26 claims
- 2371US7438481B2Optical semiconductor module and semiconductor device including the sameTOSHIBA KK·Filed 2005·Granted Oct 21, 2008·4 cites·20 claims
- 2471US6229099B1Multi-layer circuit board with particular pad spacingSHINKO ELECTRIC IND CO·Filed 1998·Granted May 8, 2001·37 cites·6 claims
- 2571US5543663ASemiconductor device and BGA packageTOSHIBA KK·Filed 1994·Granted Aug 6, 1996·44 cites·66 claims
- 2670US6049130ASemiconductor device using gold bumps and copper leads as bonding elementsTOSHIBA KK·Filed 1997·Granted Apr 11, 2000·32 cites·3 claims
- 2769US7405159B2Method of fabricating a semiconductor device package having a semiconductor element with a roughened surfaceTOSHIBA KK·Filed 2007·Granted Jul 29, 2008·3 cites·22 claims
- 2868US4949163ASemiconductor integrated circuit device particularly for high speed logic operationsTOSHIBA KK·Filed 1988·Granted Aug 14, 1990·33 cites·11 claims
- 2967US9633902B2Method for manufacturing semiconductor device that includes dividing semiconductor substrate by dry etchingTOSHIBA KK·Filed 2015·Granted Apr 25, 2017·1 cites·20 claims
- 3067US6271478B1Multi-layer circuit boardSHINKO ELECTRIC IND CO·Filed 1998·Granted Aug 7, 2001·35 cites·2 claims
- 3167US5304843ASemiconductor device using film carrierTOSHIBA KK·Filed 1992·Granted Apr 19, 1994·40 cites·27 claims
- 3267US5021866ASemiconductor integrated circuit apparatusTOSHIBA KK·Filed 1988·Granted Jun 4, 1991·32 cites·14 claims
- 3366US8237285B2Semiconductor device, through hole having expansion portion and thin insulating filmTANIDA KAZUMASA·Filed 2009·Granted Aug 7, 2012·3 cites·11 claims
- 3466US7877871B2Method of manufacturing an electronic circuit formed on a substrateTOSHIBA KK·Filed 2008·Granted Feb 1, 2011·2 cites·2 claims
- 3564US7401983B2Method for manufacturing optical coupling part and optical coupling partSUMITOMO ELECTRIC INDUSTRIES·Filed 2006·Granted Jul 22, 2008·3 cites·10 claims
- 3664US6452115B2Circuit pattern for multi-layer circuit board for mounting electronic partsSHINKO ELECTRIC IND CO·Filed 2001·Granted Sep 17, 2002·11 cites·6 claims
- 3764US6094057ABoard for evaluating the characteristics of a semiconductor chip and a method for mounting a semiconductor chip thereonTOSHIBA KK·Filed 1996·Granted Jul 25, 2000·25 cites·6 claims
- 3863US7433637B2Image forming apparatus and method of manufacturing electronic circuit using the sameKABSUSHIKI KAISHA TOSHIBA·Filed 2005·Granted Oct 7, 2008·4 cites·12 claims
- 3962US7469941B2Method of producing a wiring boardTOSHIBA KK·Filed 2006·Granted Dec 30, 2008·1 cites·6 claims
- 4061US6977130B2Method of manufacturing an electronic circuit and manufacturing apparatus of an electronic circuitTOSHIBA KK·Filed 2003·Granted Dec 20, 2005·10 cites·22 claims
- 4161US5533664AMethod of manufacturing a semiconductor deviceTOSHIBA KK·Filed 1994·Granted Jul 9, 1996·28 cites·11 claims
- 4260US7071576B2Semiconductor device and method of manufacturing the sameTOSHIBA KK·Filed 2004·Granted Jul 4, 2006·9 cites·20 claims
- 4360US5162896AIC package for high-speed semiconductor integrated circuit deviceTOSHIBA KK·Filed 1991·Granted Nov 10, 1992·29 cites·20 claims
- 4459US8309430B2Semiconductor manufacturing apparatus and semiconductor manufacturing methodTANIDA KAZUMASA·Filed 2011·Granted Nov 13, 2012·1 cites·20 claims
- 4555US5508563ASemiconductor assembly having laminated semiconductor devicesTOSHIBA KK·Filed 1994·Granted Apr 16, 1996·20 cites·6 claims
- 4654US10424542B2Semiconductor deviceTOSHIBA KK·Filed 2017·Granted Sep 24, 2019·0 cites·18 claims
- 4754US6617678B2Semiconductor deviceTOSHIBA KK·Filed 2002·Granted Sep 9, 2003·6 cites·30 claims
- 4853US2005053772A1Wiring board and multilayer wiring boardFiled 2004·Application pending·0 cites
- 4952US8220147B2Metal-containing resin particle, resin particle, electronic circuit substrate, and method of producing electronic circuitYAMAGUCHI NAOKO·Filed 2009·Granted Jul 17, 2012·0 cites·7 claims
- 5052US7608911B2Semiconductor device package having a semiconductor element with a roughened surfaceTOSHIBA KK·Filed 2008·Granted Oct 27, 2009·0 cites·13 claims
Showing the top 50 of 78 patent records by PatentIndex Score.
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