Inventor · disambiguated record
Barbara Lehner
Also filed as: LEHNER BARBARA
7 granted patents·151 citations·filing 1990–1999
87Inventor score
Top patents by PatentIndex Score
7 records- 0169US5940550AElectrooptical moduleSIEMENS AG·Filed 1998·Granted Aug 17, 1999·40 cites·5 claims
- 0269US5366573AUV-curable adhesive semiconductor chip mounting processSIEMENS NIXDORF INF SYST·Filed 1990·Granted Nov 22, 1994·48 cites·6 claims
- 0362US6037043AUV-hardenable and thermally hardenable epoxy resins for underfilling electrical and electronic componentsSIEMENS AG·Filed 1997·Granted Mar 14, 2000·24 cites·7 claims
- 0449US6194482B1UV-hardenable and thermally hardenable epoxy resins for underfilling electrical and electronic componentsSIEMENS AG·Filed 1999·Granted Feb 27, 2001·12 cites·13 claims
- 0543US6150435AOne-component epoxy resin for covering electronic componentsSIEMENS AG·Filed 1998·Granted Nov 21, 2000·11 cites·12 claims
- 0642US5468786ARadiation-curable reaction resin systemSIEMENS AG·Filed 1994·Granted Nov 21, 1995·5 cites·6 claims
- 0733US5158990ACoating compounds for electrical and electronic components containing vitreons fused silicaSIEMENS AG·Filed 1992·Granted Oct 27, 1992·11 cites·10 claims
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