Inventor · disambiguated record
Hideyuki Akagi
Also filed as: AKAGI HIDEYUKI
9 granted patents·3 pending applications·155 citations·filing 1992–2005
89Inventor score
Top patents by PatentIndex Score
12 records- 0185US5296324AToner for developing electrostatic charge image and process for preparing the sameFUJI XEROX CO LTD·Filed 1992·Granted Mar 22, 1994·33 cites·11 claims
- 0280US5429902AElectrophotographic toner composition and image formation method using the sameFUJI XEROX CO LTD·Filed 1993·Granted Jul 4, 1995·32 cites·11 claims
- 0371US5851719ADeveloping sleeve for electrophotography and process for image formationFUJI XEROX CO LTD·Filed 1996·Granted Dec 22, 1998·21 cites·12 claims
- 0469US5804351AToner for electrostatic-image development, developer for electrostatic image, and image forming process using the sameFUJI XEROX CO LTD·Filed 1996·Granted Sep 8, 1998·21 cites·6 claims
- 0561US5250996AMethod for fixing full color toner imagesFUJI XEROX CO LTD·Filed 1992·Granted Oct 5, 1993·13 cites·2 claims
- 0656US5529871AColor toner and process for producing the sameFUJI XEROX CO LTD·Filed 1994·Granted Jun 25, 1996·10 cites·9 claims
- 0753US7171152B2Image-forming apparatus and image-forming methodFUJI XEROX CO LTD·Filed 2004·Granted Jan 30, 2007·5 cites·10 claims
- 0851US5738962AToner for full-color image formation, developer composition, and method of forming multicolor imageFUJI XEROX CO LTD·Filed 1996·Granted Apr 14, 1998·10 cites·9 claims
- 0949US6212350B1Formation method, image formation system, and intermediate transfer body having a photoconductive resistivity change layerFUJI XEROX CO LTD·Filed 1999·Granted Apr 3, 2001·10 cites·22 claims
- 1046US2005176173A1Chip-on-board module, and method of manufacturing the sameRENESAS TECH CORP·Filed 2005·Application pending·0 cites
- 1139US2003020155A1Chip-on-board module, and method of manufacturing the sameMITSUBISHI ELECTRIC CORP·Filed 2002·Application pending·0 cites
- 1233US2002025608A1Memory module, method of manufacturing the memory module, and test connector using the memory moduleMITSUBISHI ELECTRIC CORP·Filed 2001·Application pending·0 cites
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