Inventor
SHINGAI NOBORU
JP3 patents
Patents
3 patentsUS6239983B1May 29, 2001
Circuit board, manufacturing method therefor, and bump-type contact head and semiconductor component packaging module using the circuit board
MEIKO ELECTRONICS CO LTD58 citations93
US5886877AMar 23, 1999
Circuit board, manufacturing method therefor, and bump-type contact head and semiconductor component packaging module using the circuit board
MEIKO ELECTRONICS CO LTD54 citations93
US6350957B1Feb 26, 2002
Circuit board, manufacturing method therefor, and bump-type contact head and semiconductor component packaging module using the circuit board
MEIKO ELECTRONICS CO LTD32 citations90