Inventor · disambiguated record
Albert J. Laninga
Also filed as: LANINGA ALBERT · LANINGA ALBERT J · LANINGA ALBERT JOHN · LANINGA SR ALBERT J
11 granted patents·316 citations·filing 1988–2000
92Inventor score
Top patents by PatentIndex Score
11 records- 0190US4934671ASelf aligning air bearing platformMOTOROLA INC·Filed 1989·Granted Jun 19, 1990·46 cites·3 claims
- 0288US5834062AMaterial transfer apparatus and method of using the sameMOTOROLA INC·Filed 1997·Granted Nov 10, 1998·71 cites·21 claims
- 0382US6116791AOptical coupler and method for coupling an optical fiber to an optoelectric deviceMOTOROLA INC·Filed 1998·Granted Sep 12, 2000·65 cites·22 claims
- 0473US5928595AMethod of manufacturing a semiconductor componentMOTOROLA INC·Filed 1997·Granted Jul 27, 1999·32 cites·7 claims
- 0567US6081031ASemiconductor package consisting of multiple conductive layersSEMICONDUCTOR COMPONENTS IND·Filed 1998·Granted Jun 27, 2000·27 cites·20 claims
- 0667US5195656AAccurately controlled fluid dispenser with upper and lower stroke adjustersMOTOROLA INC·Filed 1991·Granted Mar 23, 1993·29 cites·19 claims
- 0760US5344296AMethod and apparatus for forming a runner in a mold assemblyMOTOROLA INC·Filed 1993·Granted Sep 6, 1994·19 cites·20 claims
- 0847US5851559ATransfer molding pressMOTOROLA INC·Filed 1995·Granted Dec 22, 1998·14 cites·12 claims
- 0939US6376266B1Semiconductor package and method for forming sameSEMICONDUCTOR COMPONENTS IND·Filed 2000·Granted Apr 23, 2002·1 cites·16 claims
- 1039US4830609ACuring oven system for semiconductor devicesMOTOROLA INC·Filed 1988·Granted May 16, 1989·5 cites·19 claims
- 1129US6118175AWire bonding support structure and method for coupling a semiconductor chip to a leadframeMOTOROLA INC·Filed 1998·Granted Sep 12, 2000·7 cites·20 claims
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