Inventor · disambiguated record
Nishant Sinha
Also filed as: SINHA NISHANT · SINHA NISHANT K · SINHA NISHANT KUMAR
149 granted patents·28 pending applications·1,726 citations·filing 2000–2023
99Inventor score
Top patents by PatentIndex Score
177 records- 0199US7345350B2Process and integration scheme for fabricating conductive components, through-vias and semiconductor components including conductive through-wafer viasMICRON TECHNOLOGY INC·Filed 2003·Granted Mar 18, 2008·258 cites·10 claims
- 0298US8178396B2Methods for forming three-dimensional memory devices, and related structuresSINHA NISHANT·Filed 2009·Granted May 15, 2012·57 cites·22 claims
- 0398US7265052B2Methods of forming conductive through-wafer viasMICRON TECHNOLOGY INC·Filed 2005·Granted Sep 4, 2007·64 cites·26 claims
- 0498US6906418B2Semiconductor component having encapsulated, bonded, interconnect contactsMICRON TECHNOLOGY INC·Filed 2003·Granted Jun 14, 2005·140 cites·29 claims
- 0598US6551935B1Slurry for use in polishing semiconductor device conductive structures that include copper and tungsten and polishing methodsMICRON TECHNOLOGY INC·Filed 2000·Granted Apr 22, 2003·147 cites·151 claims
- 0697US7603772B2Methods of fabricating substrates including one or more conductive viasMICRON TECHNOLOGY INC·Filed 2007·Granted Oct 20, 2009·41 cites·16 claims
- 0796US7335935B2Semiconductor structuresMICRON TECHNOLOGY INC·Filed 2005·Granted Feb 26, 2008·32 cites·15 claims
- 0896US6803303B1Method of fabricating semiconductor component having encapsulated, bonded, interconnect contactsMICRON TECHNOLOGY INC·Filed 2002·Granted Oct 12, 2004·80 cites·47 claims
- 0996US6602117B1Slurry for use with fixed-abrasive polishing pads in polishing semiconductor device conductive structures that include copper and tungsten and polishing methodsMICRON TECHNOLOGY INC·Filed 2000·Granted Aug 5, 2003·82 cites·76 claims
- 1095US6852627B2Conductive through wafer viasMICRON TECHNOLOGY INC·Filed 2003·Granted Feb 8, 2005·81 cites·51 claims
- 1194US8722525B2Multi-tiered semiconductor devices and associated methodsSINHA NISHANT·Filed 2011·Granted May 13, 2014·14 cites·29 claims
- 1294US6936536B2Methods of forming conductive through-wafer viasMICRON TECHNOLOGY INC·Filed 2002·Granted Aug 30, 2005·64 cites·54 claims
- 1393US7666788B2Methods for forming conductive vias in semiconductor device componentsMICRON TECHNOLOGY INC·Filed 2007·Granted Feb 23, 2010·19 cites·23 claims
- 1492US10210054B1Backup optimization in hybrid storage environmentIBM·Filed 2018·Granted Feb 19, 2019·10 cites·1 claims
- 1591US9147691B2Multi-tiered semiconductor devices and associated methodsMICRON TECHNOLOGY INC·Filed 2014·Granted Sep 29, 2015·7 cites·11 claims
- 1691US7608904B2Semiconductor device components with conductive vias and systems including the componentsMICRON TECHNOLOGY INC·Filed 2007·Granted Oct 27, 2009·14 cites·27 claims
- 1790US11465354B2Fabrication of additive manufacturing partsBOEING CO·Filed 2020·Granted Oct 11, 2022·2 cites·26 claims
- 1890US8336034B2Modular bug detection with inertial refinementSINHA NISHANT·Filed 2010·Granted Dec 18, 2012·13 cites·16 claims
- 1989US9576904B2Semiconductor devices comprising interconnect structures and methods of fabricationMICRON TECHNOLOGY INC·Filed 2015·Granted Feb 21, 2017·5 cites·18 claims
- 2089US7935242B2Method of selectively removing conductive materialMICRON TECHNOLOGY INC·Filed 2006·Granted May 3, 2011·13 cites·37 claims
- 2189US7928577B2Interconnect structures for integration of multi-layered integrated circuit devices and methods for forming the sameMICRON TECHNOLOGY INC·Filed 2008·Granted Apr 19, 2011·12 cites·22 claims
- 2289US7005379B2Semiconductor processing methods for forming electrical contactsMICRON TECHNOLOGY INC·Filed 2004·Granted Feb 28, 2006·37 cites·21 claims
- 2387US8508997B2Multi-cell vertical memory nodesTANG SANH D·Filed 2009·Granted Aug 13, 2013·13 cites·13 claims
- 2487US8226840B2Methods of removing silicon dioxideSINHA NISHANT·Filed 2008·Granted Jul 24, 2012·8 cites·6 claims
- 2587US6710442B1Microelectronic devices with improved heat dissipation and methods for cooling microelectronic devicesMICRON TECHNOLOGY INC·Filed 2002·Granted Mar 23, 2004·32 cites·58 claims
- 2686US11027485B2Sheet-based additive manufacturing methodsBOEING CO·Filed 2017·Granted Jun 8, 2021·2 cites·22 claims
- 2786US8707278B2Embedding class hierarchy into object models for multiple class inheritanceBALAKRISHNAN GOGUL·Filed 2011·Granted Apr 22, 2014·17 cites·19 claims
- 2886US7981221B2Rheological fluids for particle removalMICRON TECHNOLOGY INC·Filed 2008·Granted Jul 19, 2011·7 cites·23 claims
- 2986US7786016B2Methods of uniformly removing silicon oxide and a method of removing a sacrificial oxideMICRON TECHNOLOGY INC·Filed 2007·Granted Aug 31, 2010·11 cites·27 claims
- 3086US6756682B2High aspect ratio fill method and resulting structureMICRON TECHNOLOGY INC·Filed 2003·Granted Jun 29, 2004·28 cites·32 claims
- 3185US7118686B2Slurry for use in polishing semiconductor device conductive structures that include copper and tungsten and polishing methodsMICRON TECHNOLOGY INC·Filed 2002·Granted Oct 10, 2006·23 cites·37 claims
- 3284US8735902B2Memories with memory arrays extending in opposite directions from a semiconductor and their formationTANG SANH D·Filed 2010·Granted May 27, 2014·7 cites·12 claims
- 3384US6787450B2High aspect ratio fill method and resulting structureMICRON TECHNOLOGY INC·Filed 2002·Granted Sep 7, 2004·26 cites·25 claims
- 3483US12017404B2Additive manufacturing powder particle, method for treating the additive manufacturing powder particle, and method for additive manufacturingBOEING CO·Filed 2023·Granted Jun 25, 2024·0 cites·20 claims
- 3583US8446767B2Memories and their formationTANG SANH D·Filed 2010·Granted May 21, 2013·8 cites·38 claims
- 3683US8131768B2Symbolic program analysis using term rewriting and generalizationSINHA NISHANT·Filed 2008·Granted Mar 6, 2012·12 cites·20 claims
- 3783US7915735B2Selective metal deposition over dielectric layersMICRON TECHNOLOGY INC·Filed 2005·Granted Mar 29, 2011·8 cites·64 claims
- 3883US6757971B2Filling plugs through chemical mechanical polishMICRON TECHNOLOGY INC·Filed 2001·Granted Jul 6, 2004·21 cites·14 claims
- 3982US11010356B2Priority based failover for databasesIBM·Filed 2017·Granted May 18, 2021·3 cites·20 claims
- 4082US8664112B2Methods for forming interconnect structures for integration of multi-layered integrated circuit devicesSANDHU GURTEJ S·Filed 2011·Granted Mar 4, 2014·4 cites·20 claims
- 4182US8148263B2Methods for forming conductive vias in semiconductor device componentsSINHA NISHANT·Filed 2009·Granted Apr 3, 2012·6 cites·25 claims
- 4282US7750477B2Through-hole contacts in a semiconductor deviceROUND ROCK RES LLC·Filed 2007·Granted Jul 6, 2010·7 cites·10 claims
- 4382US7115515B2Methods for forming capacitor structuresMICRON TECHNOLOGY INC·Filed 2005·Granted Oct 3, 2006·5 cites·8 claims
- 4481US12134256B2Coated sheets for improved additive manufacturing partsBOEING CO·Filed 2023·Granted Nov 5, 2024·0 cites·12 claims
- 4581US8949795B2Generating test cases for covering enterprise rules and predicatesCHANDRA SATISH·Filed 2012·Granted Feb 3, 2015·9 cites·23 claims
- 4681US8524599B2Methods of forming at least one conductive element and methods of forming a semiconductor structureTANG SANH D·Filed 2011·Granted Sep 3, 2013·4 cites·22 claims
- 4781US7316063B2Methods of fabricating substrates including at least one conductive viaMICRON TECHNOLOGY INC·Filed 2004·Granted Jan 8, 2008·21 cites·16 claims
- 4881US6900128B2Activation of oxides for electroless platingMICRON TECHNOLOGY INC·Filed 2004·Granted May 31, 2005·18 cites·33 claims
- 4981US6872659B2Activation of oxides for electroless platingMICRON TECHNOLOGY INC·Filed 2002·Granted Mar 29, 2005·18 cites·40 claims
- 5080US8951354B2Megasonic cleaning with controlled boundary layer thickness and associated systems and methodsSINHA NISHANT·Filed 2012·Granted Feb 10, 2015·3 cites·10 claims
Showing the top 50 of 177 patent records by PatentIndex Score.
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