Inventor · disambiguated record
Emiko Kawamura
Also filed as: KAWAMURA EMIKO
41 granted patents·8 citations·filing 2019–2020
94Inventor score
Files withDISCO CORP41
Top patents by PatentIndex Score
41 records- 0190US11289379B2Wafer processing methodDISCO CORP·Filed 2020·Granted Mar 29, 2022·2 cites·12 claims
- 0281US11024543B2Wafer processing method including applying a polyester sheet to a waferDISCO CORP·Filed 2020·Granted Jun 1, 2021·1 cites·13 claims
- 0380US10991624B2Wafer processing method including applying a polyolefin sheet to a waferDISCO CORP·Filed 2020·Granted Apr 27, 2021·1 cites·14 claims
- 0479US10847420B2Wafer processing methodDISCO CORP·Filed 2019·Granted Nov 24, 2020·2 cites·11 claims
- 0572US11037814B2Wafer processing method using a ring frame with a polyester sheet with no adhesive layerDISCO CORP·Filed 2019·Granted Jun 15, 2021·1 cites·13 claims
- 0671US11062948B2Wafer processing methodDISCO CORP·Filed 2019·Granted Jul 13, 2021·1 cites·12 claims
- 0760US11545393B2Wafer processing method including uniting wafer, ring frame and polyester sheet without using an adhesive layerDISCO CORP·Filed 2020·Granted Jan 3, 2023·0 cites·8 claims
- 0849US11610815B2Wafer processing method including uniting wafer, ring frame, and polyolefin sheet without using an adhesive layerDISCO CORP·Filed 2020·Granted Mar 21, 2023·0 cites·11 claims
- 0949US11594454B2Wafer processing method including uniting wafer, ring frame and polyolefin sheet without using an adhesive layerDISCO CORP·Filed 2020·Granted Feb 28, 2023·0 cites·11 claims
- 1049US11587833B2Wafer processing method including uniting wafer, ring frame, and polyolefin sheet without using an adhesive layerDISCO CORP·Filed 2020·Granted Feb 21, 2023·0 cites·11 claims
- 1149US11587832B2Wafer processing method including uniting wafer, ring frame and polyolefin sheet without using an adhesive layerDISCO CORP·Filed 2020·Granted Feb 21, 2023·0 cites·11 claims
- 1249US11476161B2Wafer processing method including applying a polyolefin sheet to a waferDISCO CORP·Filed 2020·Granted Oct 18, 2022·0 cites·13 claims
- 1349US11393721B2Wafer processing methodDISCO CORP·Filed 2020·Granted Jul 19, 2022·0 cites·12 claims
- 1449US11380588B2Wafer processing method including uniting a wafer, a ring frame and a polyester sheet without using an adhesive layerDISCO CORP·Filed 2020·Granted Jul 5, 2022·0 cites·15 claims
- 1549US11322407B2Wafer processing method including applying a polyester sheet to a waferDISCO CORP·Filed 2020·Granted May 3, 2022·0 cites·12 claims
- 1648US11380587B2Wafer processing method including uniting a wafer, a ring frame and a polyester sheet without using an adhesive layerDISCO CORP·Filed 2020·Granted Jul 5, 2022·0 cites·15 claims
- 1748US11361997B2Wafer processing method including uniting a wafer, ring frame and a polyolefin sheet without using an adhesive layerDISCO CORP·Filed 2020·Granted Jun 14, 2022·0 cites·21 claims
- 1848US11322406B2Wafer processing methodDISCO CORP·Filed 2020·Granted May 3, 2022·0 cites·8 claims
- 1948US11270916B2Wafer processing methodDISCO CORP·Filed 2020·Granted Mar 8, 2022·0 cites·18 claims
- 2048US11049772B2Wafer processing method including applying a polyester sheet to a waferDISCO CORP·Filed 2020·Granted Jun 29, 2021·0 cites·13 claims
- 2147US11302578B2Wafer processing methodDISCO CORP·Filed 2020·Granted Apr 12, 2022·0 cites·9 claims
- 2247US11251082B2Wafer processing methodDISCO CORP·Filed 2020·Granted Feb 15, 2022·0 cites·8 claims
- 2347US11056334B2Wafer processing method using a ring frame and a polyester sheetDISCO CORP·Filed 2019·Granted Jul 6, 2021·0 cites·10 claims
- 2447US11049757B2Wafer processing method including applying a polyester sheet to a waferDISCO CORP·Filed 2020·Granted Jun 29, 2021·0 cites·13 claims
- 2547US11031234B2Wafer processing method including applying a polyolefin sheet to a waferDISCO CORP·Filed 2019·Granted Jun 8, 2021·0 cites·15 claims
- 2647US11018058B2Wafer processing method for dividing a wafer along predefined division lines using polyester sheetDISCO CORP·Filed 2020·Granted May 25, 2021·0 cites·9 claims
- 2747US11011407B2Wafer processing method using a ring frame and a polyolefin sheetDISCO CORP·Filed 2019·Granted May 18, 2021·0 cites·11 claims
- 2847US11004744B2Wafer processing method for dividing a wafer along predefined division linesDISCO CORP·Filed 2020·Granted May 11, 2021·0 cites·10 claims
- 2947US10998232B2Wafer processing method of uniting a wafer and a ring frame using a polyolefin sheetDISCO CORP·Filed 2020·Granted May 4, 2021·0 cites·9 claims
- 3047US10991587B2Wafer processing method including applying a polyester sheet to a waferDISCO CORP·Filed 2019·Granted Apr 27, 2021·0 cites·14 claims
- 3147US10985067B2Wafer processing method using a laser beam dividing stepDISCO CORP·Filed 2020·Granted Apr 20, 2021·0 cites·18 claims
- 3247US10720355B2Wafer processing methodDISCO CORP·Filed 2019·Granted Jul 21, 2020·0 cites·9 claims
- 3346US11127633B2Wafer processing method including a thermocompression bonding step of bonding a wafer to a ring frame via a polyolefin sheetDISCO CORP·Filed 2019·Granted Sep 21, 2021·0 cites·21 claims
- 3446US11069574B2Wafer processing method including applying a polyester sheet to a waferDISCO CORP·Filed 2019·Granted Jul 20, 2021·0 cites·20 claims
- 3546US11043421B2Wafer processing methodDISCO CORP·Filed 2019·Granted Jun 22, 2021·0 cites·21 claims
- 3646US11037813B2Wafer processing methodDISCO CORP·Filed 2019·Granted Jun 15, 2021·0 cites·25 claims
- 3746US10985066B2Wafer processing method for dividing a wafer along division linesDISCO CORP·Filed 2019·Granted Apr 20, 2021·0 cites·9 claims
- 3846US10910269B2Wafer processing methodDISCO CORP·Filed 2019·Granted Feb 2, 2021·0 cites·8 claims
- 3946US10896850B2Wafer processing methodDISCO CORP·Filed 2019·Granted Jan 19, 2021·0 cites·13 claims
- 4045US11018043B2Wafer processing method using a ring frame and a polyester sheetDISCO CORP·Filed 2019·Granted May 25, 2021·0 cites·10 claims
- 4139US11298928B2Protective sheet disposing methodDISCO CORP·Filed 2019·Granted Apr 12, 2022·0 cites·10 claims
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →